1.
A Study of the Creep Property of Sn-9Zn Solder and Its Strengthen;
Sn-9Zn钎料蠕变性能及其复合增强研究
2.
Effects of Ga,Al and Ag multi-additions on wetting properties of Sn-9Zn lead-free solders
复合添加Ga,Al,Ag对Sn-9Zn钎料性能的影响
3.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
4.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
5.
Effect of Cu addition on Sn-9Zn lead-free solder properties
添加铜对Sn-9Zn无铅钎料性能的影响
6.
Effect of Pb on Propert of Sn-9Zn Alloy Solder
微量铅对Sn-9Zn合金钎料性能的影响
7.
Wettability of Sn-9Zn-xAg lead-free solder and mechanical properties of soldered joints
Sn-9Zn-xAg无铅钎料润湿性能及焊点力学性能
8.
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
9.
Investigation on the Wettability and Interfacial Structure of Sn-9Zn-xAg Solders on Cu Substrate
Sn-9Zn-xAg钎料在Cu基材上润湿性能及界面组织的研究
10.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
11.
Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;
基于Sn-Pb-Zn钎料铝合金钎焊工艺研究
12.
A Study of Sn-9Zn Lead-free Electronic Solder and Its Improvement by Alloying;
Sn-9Zn无铅电子焊料及其合金化改性研究
13.
Effects of trace RE and Al on microstructure and properties of lead-free solder alloy of Sn-9Zn
微量RE和Al对Sn-9Zn焊料组织与性能的影响
14.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
15.
CROSS SECTION CHANGING GROWTH PHENOMENON OF Sn WHISKER IN Sn-3.8Ag-0.7Cu-1.0Er LEAD-FREE SOLDER
Sn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象
16.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
17.
Effect of Alloy Element Addtion on IMC at the Soldering Interface of Sn-based Binary Solders;
合金元素对二元Sn基钎料钎焊界面IMC的影响
18.
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响