1.
Effects of trace RE and Al on microstructure and properties of lead-free solder alloy of Sn-9Zn
微量RE和Al对Sn-9Zn焊料组织与性能的影响
2.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
3.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
4.
A Study of Sn-9Zn Lead-free Electronic Solder and Its Improvement by Alloying;
Sn-9Zn无铅电子焊料及其合金化改性研究
5.
Wettability of Sn-9Zn-xAg lead-free solder and mechanical properties of soldered joints
Sn-9Zn-xAg无铅钎料润湿性能及焊点力学性能
6.
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
7.
A Study of the Creep Property of Sn-9Zn Solder and Its Strengthen;
Sn-9Zn钎料蠕变性能及其复合增强研究
8.
Effect of Cu addition on Sn-9Zn lead-free solder properties
添加铜对Sn-9Zn无铅钎料性能的影响
9.
Effect of Pb on Propert of Sn-9Zn Alloy Solder
微量铅对Sn-9Zn合金钎料性能的影响
10.
Effects of Ga,Al and Ag multi-additions on wetting properties of Sn-9Zn lead-free solders
复合添加Ga,Al,Ag对Sn-9Zn钎料性能的影响
11.
Investigation on the Wettability and Interfacial Structure of Sn-9Zn-xAg Solders on Cu Substrate
Sn-9Zn-xAg钎料在Cu基材上润湿性能及界面组织的研究
12.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
13.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
14.
Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;
基于Sn-Pb-Zn钎料铝合金钎焊工艺研究
15.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
16.
Study on Indentation Creep Behavior of the Sn-Ag-Bi Lead-free Solder;
Sn-Ag-Bi无铅焊料压入蠕变性能的研究
17.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
18.
The Study of Sn-3.0Ag-0.5Cu-XNi Lead-free Solder and Joint Point Microstructure and Property
Sn-3.0Ag-0.5Cu-XNi钎料及焊点组织和性能研究