1) solder joint reliability
焊点可靠性
1.
Integrating with the experience of practical work, the void phenomenon of Ball Grid Array and the emergent mechanism of void were discussed in the paper, and the influence of void on solder joint reliability were discussed on emphasis.
结合实际工作中的经验和体会,探讨球栅阵列元器件焊点的气孔现象及其产生机理,重点讨论气孔与焊点可靠性的关系,认为非焊点与基板界面处(IMC)及焊点和BGA的Substrate结合处的气孔对焊点可靠性的影响不是很显著。
2.
With the change of material and technics in electronic packaging,it brings the problem of solder joint reliability.
由于封装材料与封装工艺的改变,给焊点可靠性带来了一系列相关问题。
3.
And the influence of Cr on solder joint reliability has been studied.
此外,本文还采用时效的方法研究了Sn-Zn-Bi合金与Cu和Ni基底钎焊的焊点界面反应和界面金属间化合物长大行为,并探讨了Cr对Sn-Zn-Bi合金的焊点可靠性的影响。
2) Reliability of solder joints
焊点可靠性
1.
Because of the high integration level of electronic packaging, evaluating solder joints reliability is more and more difficult, and lead-free packaging also bring new problems to the research on reliability of solder joints.
电子封装高度集成化,使得焊点可靠性评估更加困难,而封装无铅化,又给焊点可靠性研究带来新的问题。
3) Weldability
焊接可靠性
1.
Studies on the Weldability of Dental Metallic Material;
口腔科医用焊接材料焊接可靠性研究
4) Reliability spot inspection
可靠性点检
5) reliability of ignition
点火可靠性
补充资料：可焊性镀层
分子式：
CAS号：
性质：用于提高金属零件的钎焊性能的电镀层。如用于印制板的铅锡合金镀层及用于电子元器件的银镀层等。
CAS号：
性质：用于提高金属零件的钎焊性能的电镀层。如用于印制板的铅锡合金镀层及用于电子元器件的银镀层等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条