1.
BGA Assembly Technology Research for Solder Ball's Reliability
对BGA封装技术中锡球焊接可靠性的研究
2.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
3.
Study on Welding Technology and Reliability of X80 Pipeline Steel;
X80管线钢焊接工艺及可靠性研究
4.
A Study of Interconnection Reliability for Low-temperature Sintered Nano-silver Paste;
纳米银焊膏低温烧结粘接可靠性研究
5.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
6.
Research on the Reliability of the Friction Welded Joints in Power Plants Boiler Serpentine Pipe;
电站锅炉蛇形管摩擦焊接头可靠性研究
7.
Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages
焊盘尺寸对FC-PBGA焊点可靠性的影响
8.
I certainly doubt the quality and reliability of the battery self replacement as normally the battery cell contacts will be spot-welded instead of soldering.
当然，我毫无疑问的质量和可靠性的电池更换自律作为通常电池接触，将点焊代替焊接。
9.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
10.
The welding technic on the rectifier diode connection for improving reliability.
元件板二极管的焊点采用熔焊技术，增加可靠性。
11.
Research on Reliability of SMT Soldered Joints and FEM Analysis of CBGA Soldered Joints;
SMT焊点的可靠性研究及CBGA焊点有限元分析
12.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
13.
Research on Feasibility of WB36 Steel Welding Process Using Domestic Welding Electrode
国产焊条焊接WB36钢的工艺可行性研究
14.
A Few Measures for Increasing The Reliability of The Transistor Arc Welding Inverter
提高晶体管弧焊逆变器可靠性的措施
15.
Research Status and Prospect for 80Au-20Sn Solder Joint Reliability
80Au-20Sn钎料焊点可靠性研究现状与展望
16.
Finite element analysis on soldered joint reliability of QFN device
QFN封装焊点可靠性的有限元分析
17.
Reliability analysis of PBGA soldered joints based on Taguchi method
基于田口法的PBGA器件焊点可靠性分析
18.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析