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1)  High-Reliable Soldering
高可靠性焊接
2)  Weldability
焊接可靠性
1.
Studies on the Weldability of Dental Metallic Material;
口腔科医用焊接材料焊接可靠性研究
3)  solderability and reliability
可焊接性和可靠性
4)  Reliability Analysis of Flush Soldering
埋头焊接的可靠性
5)  solder joint reliability
焊点可靠性
1.
Integrating with the experience of practical work, the void phenomenon of Ball Grid Array and the emergent mechanism of void were discussed in the paper, and the influence of void on solder joint reliability were discussed on emphasis.
结合实际工作中的经验和体会,探讨球栅阵列元器件焊点的气孔现象及其产生机理,重点讨论气孔与焊点可靠性的关系,认为非焊点与基板界面处(IMC)及焊点和BGA的Substrate结合处的气孔对焊点可靠性的影响不是很显著。
2.
With the change of material and technics in electronic packaging,it brings the problem of solder joint reliability.
由于封装材料与封装工艺的改变,给焊点可靠性带来了一系列相关问题。
3.
And the influence of Cr on solder joint reliability has been studied.
此外,本文还采用时效的方法研究了Sn-Zn-Bi合金与Cu和Ni基底钎焊的焊点界面反应和界面金属间化合物长大行为,并探讨了Cr对Sn-Zn-Bi合金的焊点可靠性的影响。
6)  Reliability of solder joints
焊点可靠性
1.
Because of the high integration level of electronic packaging, evaluating solder joints reliability is more and more difficult, and lead-free packaging also bring new problems to the research on reliability of solder joints.
电子封装高度集成化,使得焊点可靠性评估更加困难,而封装无铅化,又给焊点可靠性研究带来新的问题。
补充资料:必然性,可靠性


必然性,可靠性
certainty

必然性,可靠性[沈r侧nty;月oeToaep毗T‘] 预先确信某事件毫无疑问会实现.必然性是某事件可实现性的特征,且标上了最高水平的概率.在概率论中,必然性的概念是与必然事件(certain event)和以概率l出现的事件相联系的.在实践中,只要某事件的概率充分接近于1,人们就称之为必然性事件.
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