1.
Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages
焊盘尺寸对FC-PBGA焊点可靠性的影响
2.
Research Status and Prospect for 80Au-20Sn Solder Joint Reliability
80Au-20Sn钎料焊点可靠性研究现状与展望
3.
Finite element analysis on soldered joint reliability of QFN device
QFN封装焊点可靠性的有限元分析
4.
Reliability analysis of PBGA soldered joints based on Taguchi method
基于田口法的PBGA器件焊点可靠性分析
5.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析
6.
Analysis on soldered joint reliability of PBGA package with different arrangement models
不同阵列PBGA器件焊点可靠性分析
7.
Research on Reliability of SMT Solder Joint in Dynamic Tensile Load
动态拉伸载荷下SMT焊点可靠性研究
8.
Reliability of SOP Component Solder Joint
小尺寸封装(SOP)器件焊点可靠性研究
9.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性
10.
Research on the Reliability of Soldered Joints and Optimum Simulation for QFP Gull Wing Lead Sizes;
QFP焊点可靠性及其翼形引线尺寸的优化模拟
11.
The Research on Reliability and Pb Contamination of Microelectronic Assembly Solder Joints;
微电子组装焊点可靠性及其铅污染问题的研究
12.
Finite Element Simulation and Life Prediction for Reliability of Lead-free Solder in PBGA;
PBGA无铅焊点可靠性的有限元模拟与寿命预测
13.
Research on Reliability of SMT Soldered Joints and FEM Analysis of CBGA Soldered Joints;
SMT焊点的可靠性研究及CBGA焊点有限元分析
14.
The welding technic on the rectifier diode connection for improving reliability.
元件板二极管的焊点采用熔焊技术，增加可靠性。
15.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
16.
Thermal reliability optimization study on PBGA lead-free solder joint
PBGA无铅焊点热可靠性优化研究
17.
Reliability Research on Solder Joint of Plastic Ball Grid Array Component
PBGA器件焊点的可靠性分析研究
18.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响