2) flip chip
倒装焊
1.
Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;
底充胶导热系数预测及对倒装焊温度场的影响
2.
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint;
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
3.
The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package;
倒装焊微电子封装结构参数的概率设计
3) flip chip bonding
倒装焊
1.
Affect and analysis of oxidation layer for the quality of flip chip bonding
氧化层对于倒装焊接质量的影响和分析
2.
Thermosonic flip chip bonding is a reliable and efficient connection technique for power optoelectron.
结合功率型GaN基蓝光LED芯片的电极分布,在硅载体上电镀制作了金凸点,然后通过热超声倒装焊接技术将LED芯片焊接到载体硅片上。
3.
The flip chip bonding process in making our photoelecton device (smart pixels) was described, and flip chip bonding technique was introduced briefly.
结合我们设计制作的倒装焊光电子器件—智能像素面阵 ,对倒装焊的工艺过程作了简要的介绍。
5) flip-chip bonding
倒装焊
1.
Latest research productions about LED chips and packaging functions are introduced,technical keys of packaging are discussed,including eutectic bonding,flip-chip bonding and cooling technology,the future trends and challenges of LED packaging technology are presented in the end.
文章对LED芯片的最新研究成果以及封装的作用做了简单介绍,重点论述了封装的关键技术,包括共晶焊接、倒装焊接以及散热技术,最后指出了未来LED封装技术的发展趋势及面临的挑战。
2.
Finally,the applicatian prospects of microwave flip-chip bonding technology is suggested and discussed.
随着应用频率的提高,微波芯片与基板间的互连更多地采用了倒装焊。
6) flip-chip
倒装焊
1.
Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint;
倒装焊焊点中金属元素迁移及组织演变
2.
The chip that used flip-chip structure could reduce heat resistance and improve heat release.
芯片采用倒装焊结构,可降低热阻,提高散热能力,对倒装焊结构的热能扩散途径进行了阐述,指出采用导热性能优良的封装材料是提高散热效率的重要途径。
3.
In this 3D-MCM,FCOB(flip-chip on board)、COB(chip on board)、BGA(ball grid array) technologies are combined together with 3D packaging,wire bonding and Flip-chip interconnection technologies are combined together,and the PBGA device and bare die are hybrid-integrated on multi-layer FR-4 substrate.
采用融合了FCOB(flip-chip onboard)、COB(chip on board)、BGA(ball grid array)等技术的三维封装(3D packaging)形式,通过倒装焊和引线键合等互连技术在高密度多层有机基板上实现了塑封BGA器件和裸芯片的混载集成。
补充资料：倒装
用颠倒词序来加强语气、协调音节或错综句法的修辞格。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条