1) face down bonder
倒装焊接机
2) flip-chip bonder
倒装焊接器
3) flip-chip bonder
倒装式焊接器
4) flip chip
倒装焊
1.
Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;
底充胶导热系数预测及对倒装焊温度场的影响
2.
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint;
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
3.
The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package;
倒装焊微电子封装结构参数的概率设计
5) flip chip bonding
倒装焊
1.
Affect and analysis of oxidation layer for the quality of flip chip bonding
氧化层对于倒装焊接质量的影响和分析
2.
Thermosonic flip chip bonding is a reliable and efficient connection technique for power optoelectron.
结合功率型GaN基蓝光LED芯片的电极分布,在硅载体上电镀制作了金凸点,然后通过热超声倒装焊接技术将LED芯片焊接到载体硅片上。
3.
The flip chip bonding process in making our photoelecton device (smart pixels) was described, and flip chip bonding technique was introduced briefly.
结合我们设计制作的倒装焊光电子器件—智能像素面阵 ,对倒装焊的工艺过程作了简要的介绍。
补充资料：倒装
用颠倒词序来加强语气、协调音节或错综句法的修辞格。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条