1.
Application of Machine Vision System in Flip-Chip-Bonding Equipment
机器视觉系统在倒装焊设备中的应用
2.
Choice of Soldering Equipment in Electronic Assembly
电子组装中焊接设备的选择(续完)
3.
Electromigration in Sn3.0Ag0.5Cu flip chip solder joint
Sn3.0Ag0.5Cu倒装焊点中的电迁移
4.
Safety requirements for arc welding equipment Part 12: Coupling devices for welding cables
GB15579.12-1998弧焊设备安全要求第12部分:焊接电缆耦合装置
5.
Usage and maintenance of welding and cutting machine(4)-- Installation,usage and maintenance for AC arc welding machine
焊接与切割设备的使用和维修(四)——交流弧焊机的安装、使用与维修
6.
Usage and maintenance of welding and cutting machines(5)--Repairing examples and refitting for AC arc welding machines
焊接与切割设备的使用和维修(五)——交流弧焊机的检修实例和改装
7.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
8.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
9.
Dealing with the Problem of Big Dip Angle On Preventing Slipping Equipment Installment;
大倾角综采面设备安装防倒防滑问题处理
10.
Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint;
倒装焊焊点中金属元素迁移及组织演变
11.
Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability
倒装焊器件尺寸参数对低k层及焊点的影响
12.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
13.
Prepare welding fixture and assy fixture application, and discuss with tooling engineer together for fixture design.
准备焊接,组装夹具申请,并与夹具设计者讨论如何设计夹具.
14.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
15.
Locator Optimization for Resistance-spot-welding Fixtures
电阻点焊焊装夹具定位点的优化设计
16.
production line and technology for manufacturing electrode
电焊条生产技术及设备
17.
nozlle for atomic hydrogen hand welding equipment
原子氢手工焊设备喷嘴
18.
The Research of Single Face Welding-Double Face Forming Automatic Welding Equipment;
单面焊双面成形自动焊接设备的研制