1.
Electromigration in Sn3.0Ag0.5Cu flip chip solder joint
Sn3.0Ag0.5Cu倒装焊点中的电迁移
2.
Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint
无铅倒装焊点的热应力与湿热应力分析
3.
Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint;
倒装焊焊点中金属元素迁移及组织演变
4.
Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability
倒装焊器件尺寸参数对低k层及焊点的影响
5.
Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究
6.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
7.
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
8.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
9.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
10.
Locator Optimization for Resistance-spot-welding Fixtures
电阻点焊焊装夹具定位点的优化设计
11.
spot-welded bar
以点焊方法安装的铁枝
12.
Application of Machine Vision System in Flip-Chip-Bonding Equipment
机器视觉系统在倒装焊设备中的应用
13.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
14.
Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling
固化残余应力对倒装焊底充胶可靠性的影响
15.
Underfill Delamination of Flip Chip on Low-Cost Board
低成本基板倒装焊底充胶分层裂缝扩展研究
16.
Application of Vision System and The Study of Contraposition Arithmetic of Flip Chip Bonding Machine
倒装焊机中视觉系统的应用及对位算法研究
17.
Affect and analysis of oxidation layer for the quality of flip chip bonding
氧化层对于倒装焊接质量的影响和分析
18.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术