1) 3D Integration and Packaging
三维集成与封装
2) integration and packaging
集成与封装
1.
Finally, this thesis gives a general introduction to the integration and packaging of monolithic microwave micro-plasma source, including block diagram and packaging technology.
最后,本论文对基于MSRR的微波微等离子体源的集成与封装做了一个总体的介绍,包括集成框图和封装工艺,并且给出了等离子体激发以后谐振器反射系数的仿真结果。
3) Tool encapsulation and integration
工具封装与集成
5) 3-D integration
三维集成
1.
Meanwhile, the vertical structure, in which charge carriers are transferred by body-migration, can significantly improve the performance of MOS devices, and the stereo-structure provides a foundation for 3-D integration.
应用此项技术能够方便地形成双栅、三栅以及围栅等各种多面栅结构;同时,应用体迁移进行载流子传输的纵向结构能够显著地改善MOS器件的性能,立体结构更为三维集成提供了发展的基础。
2.
Technology advances such as 3-D Integration are expanding the potential applications of products into mass markets such as consumer electronics.
三维集成的技术优势正在延伸到大量销售的诸如消费类电子设备潜在应用的产品领域。
6) encapsulation and integration
封装和集成
1.
In order to implement the integration and application of legacy hardware/software manufacturing resources in manufacturing enterprises, a scheme and a framework for the manufacturing resource encapsulation and integration are introduced.
针对制造企业的传统软硬件制造资源的集成和应用问题 ,提出一种基于移动Agent技术的资源封装和集成方案及框架 ,实现了在统一的Web浏览器界面下 ,通过启动不同的封装模板 ,实现对传统软硬件资源的重构和封装、信息交互和获取及协同工作等功能 ,以达到网络化制造系统对传统软硬件制造资源集成和控制的目的。
补充资料:集成
同类著作汇集在一起(多用做书名):《丛书~》ㄧ《中国古典戏曲论著~》。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条