1.
Study on Integration and Packaging of Monolithic Microwave Micro-plasma Source
单片微波微等离子体源的集成与封装研究
2.
Research on Integration of the Vision and Motion Parts in Pre-Bonding Module of RFID Packaging Machine;
RFID封装线预绑定模块的视觉与运动集成研究
3.
Research and Development on Service-Oriented Enterprise Application Integration and Services Packaging Tools;
面向服务的企业应用集成与服务封装工具研究开发
4.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
5.
Thick Film Integration Package Technology for Pressure Sensor
压力传感器的厚膜混合集成封装技术
6.
Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module
混合封装电力电子集成模块内电磁干扰的屏蔽
7.
Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;
集成电路封装用新型Al-1%Si键合线的研制
8.
The Design of Auto-inspection System of IC Package Quality;
集成电路封装质量自动检测系统的设计
9.
Electrical Simulation Research for IC Package Via
集成电路封装基板过孔电学仿真技术研究
10.
The Company's primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
11.
closed container mechanically ventilated
封闭式机械通风集装箱
12.
Cost Management Mode and Its Application in IC Assembly and Test Enterprises;
集成电路封装测试企业成本管理模式及应用研究
13.
Integrating Models and Methods for Scheduling of Loading/Unloading Operations in Container Terminals;
集装箱码头装卸作业集成调度模型与方法
14.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
15.
In relation to an integrated circuit;a term that indicates small element size and high packing density.
集成电路技术中的一种修饰术语，表示元件体积小而且封装密度高。
16.
Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP
GB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
17.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
18.
a book of blank pages with pockets or envelopes; for organizing photographs or stamp collections etc.
有口袋或封袋的空白页组成的册子；用于装照片或集邮等。