1) half and half solder
铅锡鸽的焊料
2) tin-lead solders
锡铅焊料
1.
Accordling to the basic principle of GB10574-89,the method of determination of tin in tin-lead solders was studied further.
本文根据GB10 5 74- 89《碘酸钾滴定法测定锡量》的基本原理 ,对锡铅焊料中锡的测定方法做了进一步探讨。
4) HL610 Sn-Pb solder
HL610锡铅焊料
5) tinsmith solder
锡铅软焊料
6) Tin saved Sn-Pb solder
节锡锡铅焊料
1.
The Tin saved Sn-Pb solder which Tin content decreased 10% than common Sn-Pb solder HL610 is introduced, the braze ability, mechanical properties, oxidation-resistance are better than HL610.
研究了含锡量比普通HL61 0锡铅焊料降低 1 0 % ,而焊接性能、机械性能、抗氧化性能均优于HL61 0的节锡锡铅焊料 。
补充资料:铅锡
1.即铅。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条