说明:双击或选中下面任意单词,将显示该词的音标、读音、翻译等;选中中文或多个词,将显示翻译。
您的位置:首页 -> 句库 -> 锡铅焊料
1.
Casting tin-lead solders
GB/T8012-1987铸造锡铅焊料
2.
Experimental Study on Cyclic Behavior of Eutectic Tin-Lead Solder under Multiaxial Loading;
多轴载荷下共晶锡铅焊料的循环性能实验研究
3.
Tin-lead solders-Determination of tin content-Potassium iodate titrimetric method
GB/T10574.1-1989锡铅焊料化学分析方法碘酸钾滴定法测定锡量
4.
Tin-lead solders-Determination of cadmium content-Catalytic oscillopolarographic method
GB/T10574.12-1989锡铅焊料化学分析方法催化示波极谱法测定镉量
5.
Tin-lead solders-Determination of bismuth content -Thiourea spectrophotometric method
GB/T10574.4-1989锡铅焊料化学分析方法硫脲分光光度法测定铋量
6.
Tin-lead solders-Determination of sulphur content-Oscillopolarographic method after distillation
GB/T10574.14-1989锡铅焊料化学分析方法蒸馏示波极谱法测定硫量
7.
Tin-lead solders-Determination of silver content -Potentiometric titrimetric method
GB/T10574.9-1989锡铅焊料化学分析方法电位滴定法测定银量
8.
Tin-lead solders-Determination of arsenic content -Molybdoantimony-arsenate blue spectrophotometric method
GB/T10574.6-1989锡铅焊料化学分析方法砷锑钼蓝分光光度法测定砷量
9.
Tin-lead solders-Determination of antimony content -Potassium bromate titrimetric method
GB/T10574.3-1989锡铅焊料化学分析方法溴酸钾滴定法测定锑量
10.
Tin-lead solders-Determination of silver content-Flame atomic absorption spectrophotometric method
GB/T10574.8-1989锡铅焊料化学分析方法火焰原子吸收光谱法测定银量
11.
Tin-lead solders-Determination of zinc content-Flame atomic absorption spectrophotometric method
GB/T10574.10-1989锡铅焊料化学分析方法火焰原子吸收光谱法测定锌量
12.
Tin-lead solders-Determination of antimony content- Malachite green spectrophotometric method
GB/T10574.2-1989锡铅焊料化学分析方法孔雀绿分光光度法测定锑量
13.
tin-lead 60-40 solder
锡铅60-40焊料
14.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡,材料设计、开发,焊料(锡球、锡膏)开发等。
15.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡,材料设计、发,焊料(球、膏)发等。
16.
High precision welding materials pure tin lead alloy products.
高级精密焊接纯锡铅合金材料制品。
17.
Tin-lead solder in the manufacture of professional audio equipment.
用于制造专业音响设备的铅锡焊料。
18.
Soldering materials are our major products, especially in Lead Free Soldering Materials.
焊锡物料是我们的主要产品,特别是无铅焊锡物料。