1) low temperature solidification process,LOTES process
低温固化过程
2) room-temperature curing
室温固化过程
3) low-temperature process
低温过程
1.
In order to know well the hazard of abnormal temperature change to agriculture impact of low-temperature process in midsummer on seeding of mid-season rice from spike differentiation to grouting in Jianghan Plain in recent 10 years,parallel observation was used to analyze crop and meteorological factors in this study.
为了解异常温度变化过程对农业生产的危害,采用作物与气象要素平行观测分析法初步分析了近10a江汉平原盛夏低温过程对处于穗始分化期至灌浆期的中稻结实的影响。
4) low-temperature setting
低温固化
1.
Investigation on low-temperature setting bismaleimide resin system for filament winding;
缠绕用无溶剂低温固化双马来酰亚胺树脂体系
2.
The advantages of CS-1 solidification grains are low-temperature setting, short consolidation periodand.
试验表明,CS-1防砂固结颗粒具有低温固化,固结时间短,固结强度高的特点。
5) Low temperature curing
低温固化
1.
The factors influencing the electrodeposion effects and film properties and the technology processes for high or low temperature curing were disscussed.
合成了用于阳极电泳漆的阴离子丙烯酸树脂,研究了影响树脂电沉积效果和涂膜性能的因素,探讨了涂膜在高温和低温固化的实现途径。
2.
The low temperature curing DP finishing of cotton clothes is performed with modified DMDHEU/hydro-chloric acid system and modified DMDHEU/phosphoric acid system, and provided that process conditions are properly controlled, the quality indexes of the finished fabric are satisfactory and energy saving is effected as well.
采用以矿物酸作为树脂整理催化剂的改性2D树脂/盐酸和改性2D树脂/磷酸两系统,用于棉服装低温固化耐久定形整理工艺。
3.
The selection of the adhesive ingredient,the curing mechanism of epoxy resin at low temperature and its low temperature curing properties are described,and the influence of flame retardant and smoke suppreressive filler on the properties of the adhesive is discussed.
论述了阻燃胶粘剂配方的选择、环氧树脂的低温固化机理和固化性能,讨论了无机复合阻燃抑烟填料对胶粘剂性能的影响。
6) optimization/low temperature process systems
最佳化/低温过程系统
补充资料：低温固化银浆
分子式：
CAS号：
性质：足以超细片状银粉为导电相的厚膜导体浆料，不含玻璃黏结剂，只在300℃以下温度进固化处理。有FAg-A1，TCAg-B1，TCAg-B4等，固化温度分别为80℃，120℃和90℃。通常用超细银粉或光亮银粉与溶有特殊树脂的有机黏合剂调和均匀而成。固化法包括传统空气中加热和红外固化。使用时经丝网印刷、浸渍、喷涂、涂刷和压制等方法制得牢固的导电银膜。用于固体钽电解电容器的负极过渡层、电磁屏导电膜、镀铜底层。此外也用于碳膜电阻器和印刷电阻电路的端电极等。
CAS号：
性质：足以超细片状银粉为导电相的厚膜导体浆料，不含玻璃黏结剂，只在300℃以下温度进固化处理。有FAg-A1，TCAg-B1，TCAg-B4等，固化温度分别为80℃，120℃和90℃。通常用超细银粉或光亮银粉与溶有特殊树脂的有机黏合剂调和均匀而成。固化法包括传统空气中加热和红外固化。使用时经丝网印刷、浸渍、喷涂、涂刷和压制等方法制得牢固的导电银膜。用于固体钽电解电容器的负极过渡层、电磁屏导电膜、镀铜底层。此外也用于碳膜电阻器和印刷电阻电路的端电极等。
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