2) low-moderate temperature cure
低中温固化
3) low-temperature setting
低温固化
1.
Investigation on low-temperature setting bismaleimide resin system for filament winding;
缠绕用无溶剂低温固化双马来酰亚胺树脂体系
2.
The advantages of CS-1 solidification grains are low-temperature setting, short consolidation periodand.
试验表明,CS-1防砂固结颗粒具有低温固化,固结时间短,固结强度高的特点。
4) Low temperature curing
低温固化
1.
The factors influencing the electrodeposion effects and film properties and the technology processes for high or low temperature curing were disscussed.
合成了用于阳极电泳漆的阴离子丙烯酸树脂,研究了影响树脂电沉积效果和涂膜性能的因素,探讨了涂膜在高温和低温固化的实现途径。
2.
The low temperature curing DP finishing of cotton clothes is performed with modified DMDHEU/hydro-chloric acid system and modified DMDHEU/phosphoric acid system, and provided that process conditions are properly controlled, the quality indexes of the finished fabric are satisfactory and energy saving is effected as well.
采用以矿物酸作为树脂整理催化剂的改性2D树脂/盐酸和改性2D树脂/磷酸两系统,用于棉服装低温固化耐久定形整理工艺。
3.
The selection of the adhesive ingredient,the curing mechanism of epoxy resin at low temperature and its low temperature curing properties are described,and the influence of flame retardant and smoke suppreressive filler on the properties of the adhesive is discussed.
论述了阻燃胶粘剂配方的选择、环氧树脂的低温固化机理和固化性能,讨论了无机复合阻燃抑烟填料对胶粘剂性能的影响。
5) moderate temperature
中温固化
1.
Study on one-component epoxy film adhesive curable at moderate temperature;
中温固化单组分环氧胶膜的研究
2.
This agent was a liquid at about 40℃ and could cure epoxy resins in moderate temperature.
利用新型的液体芳香胺类固化剂二甲硫基甲苯二胺(DADMT)与4,4,-二胺基二苯甲烷(DDM)共混研制了一种用于湿法缠绕的发射筒用中温固化环氧树脂体系,并对其反应性,使用期以及浇铸体的性能进行了研究。
6) moderate temperature curing
中温固化
1.
Study on accelerators for moderate temperature curing of epoxy resin;
环氧树脂中温固化促进剂的研制
2.
Some recent advances in developing moderate temperature curing epoxy resin matrix are reviewed.
阐述了在降低复合材料成本和提高复合材料性能方面 ,中温固化环氧树脂基体研制的重要性和必要性。
补充资料：低温固化银浆
分子式：
CAS号：
性质：足以超细片状银粉为导电相的厚膜导体浆料，不含玻璃黏结剂，只在300℃以下温度进固化处理。有FAg-A1，TCAg-B1，TCAg-B4等，固化温度分别为80℃，120℃和90℃。通常用超细银粉或光亮银粉与溶有特殊树脂的有机黏合剂调和均匀而成。固化法包括传统空气中加热和红外固化。使用时经丝网印刷、浸渍、喷涂、涂刷和压制等方法制得牢固的导电银膜。用于固体钽电解电容器的负极过渡层、电磁屏导电膜、镀铜底层。此外也用于碳膜电阻器和印刷电阻电路的端电极等。
CAS号：
性质：足以超细片状银粉为导电相的厚膜导体浆料，不含玻璃黏结剂，只在300℃以下温度进固化处理。有FAg-A1，TCAg-B1，TCAg-B4等，固化温度分别为80℃，120℃和90℃。通常用超细银粉或光亮银粉与溶有特殊树脂的有机黏合剂调和均匀而成。固化法包括传统空气中加热和红外固化。使用时经丝网印刷、浸渍、喷涂、涂刷和压制等方法制得牢固的导电银膜。用于固体钽电解电容器的负极过渡层、电磁屏导电膜、镀铜底层。此外也用于碳膜电阻器和印刷电阻电路的端电极等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条