1) low temperature solidified silver paste
低温固化银浆
2) low-temperature curing silver-based paste
低温固化型银基浆料
1.
Research on electric property of low-temperature curing silver-based paste
低温固化型银基浆料电性能的研究
3) low-temperature setting
低温固化
1.
Investigation on low-temperature setting bismaleimide resin system for filament winding;
缠绕用无溶剂低温固化双马来酰亚胺树脂体系
2.
The advantages of CS-1 solidification grains are low-temperature setting, short consolidation periodand.
试验表明,CS-1防砂固结颗粒具有低温固化,固结时间短,固结强度高的特点。
4) Low temperature curing
低温固化
1.
The factors influencing the electrodeposion effects and film properties and the technology processes for high or low temperature curing were disscussed.
合成了用于阳极电泳漆的阴离子丙烯酸树脂,研究了影响树脂电沉积效果和涂膜性能的因素,探讨了涂膜在高温和低温固化的实现途径。
2.
The low temperature curing DP finishing of cotton clothes is performed with modified DMDHEU/hydro-chloric acid system and modified DMDHEU/phosphoric acid system, and provided that process conditions are properly controlled, the quality indexes of the finished fabric are satisfactory and energy saving is effected as well.
采用以矿物酸作为树脂整理催化剂的改性2D树脂/盐酸和改性2D树脂/磷酸两系统,用于棉服装低温固化耐久定形整理工艺。
3.
The selection of the adhesive ingredient,the curing mechanism of epoxy resin at low temperature and its low temperature curing properties are described,and the influence of flame retardant and smoke suppreressive filler on the properties of the adhesive is discussed.
论述了阻燃胶粘剂配方的选择、环氧树脂的低温固化机理和固化性能,讨论了无机复合阻燃抑烟填料对胶粘剂性能的影响。
5) low temperature curing agent
低温固化剂
1.
Research progress of low temperature curing agent for epoxy resin composites;
环氧复合材料低温固化剂研究进展
6) low temperature fast curing
低温快固化
1.
This paper studies the formula and some properties of a new class F low temperature fast curing solvent impregnating varnish .
论文介绍了一种新型 F级低温快固化有溶剂浸渍漆的合成及其工艺性能 ,对该漆性能的影响因素进行了分析。
补充资料：低温固化银浆
分子式：
CAS号：
性质：足以超细片状银粉为导电相的厚膜导体浆料，不含玻璃黏结剂，只在300℃以下温度进固化处理。有FAg-A1，TCAg-B1，TCAg-B4等，固化温度分别为80℃，120℃和90℃。通常用超细银粉或光亮银粉与溶有特殊树脂的有机黏合剂调和均匀而成。固化法包括传统空气中加热和红外固化。使用时经丝网印刷、浸渍、喷涂、涂刷和压制等方法制得牢固的导电银膜。用于固体钽电解电容器的负极过渡层、电磁屏导电膜、镀铜底层。此外也用于碳膜电阻器和印刷电阻电路的端电极等。
CAS号：
性质：足以超细片状银粉为导电相的厚膜导体浆料，不含玻璃黏结剂，只在300℃以下温度进固化处理。有FAg-A1，TCAg-B1，TCAg-B4等，固化温度分别为80℃，120℃和90℃。通常用超细银粉或光亮银粉与溶有特殊树脂的有机黏合剂调和均匀而成。固化法包括传统空气中加热和红外固化。使用时经丝网印刷、浸渍、喷涂、涂刷和压制等方法制得牢固的导电银膜。用于固体钽电解电容器的负极过渡层、电磁屏导电膜、镀铜底层。此外也用于碳膜电阻器和印刷电阻电路的端电极等。
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