2) Flow Plating Technology (FPT)
电刷镀流镀
3) DC plating
直流电镀
1.
This article described the technical innovation and development of PCB industry, especially in DC plating and surface finish zone , which impetused the PCB industry development.
文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展。
2.
Aiming at the technology demand of advanced copper interconnect,the properties of electrodeposited copper film and parameters such as resistivity,texture coefficient,grain size and surface roughness were investigated by DC plating and pulse plating respectively.
实验结果表明,在相同电流密度条件下,脉冲电镀所得Cu镀层电阻率较低,表面粗糙度较小,表面晶粒尺寸和晶粒密度较大,而直流电镀所得镀层(111)晶面的择优程度优于脉冲。
4) galvanize
[英]['ɡælvənaɪz] [美]['gælvə'naɪz]
电镀，镀锌，通电流
5) galvanization
[英][,gælvəni'zeiʃən] [美][,gælvənɪ'zeʃən]
通电流;电镀
6) galvanization
[英][,gælvəni'zeiʃən] [美][,gælvənɪ'zeʃən]
电镀，镀锌，通电流，电疗
补充资料：标准冲击电流波形(见冲击电流发生器)
标准冲击电流波形(见冲击电流发生器)
standard impulse current wave form
blaozhun ehonglld}0n4一u box]ng标准冲击电流波形(standard impulse currentwave form)见冲击电流发生器。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条