1) electroplating using modulated current
调制电流电镀
2) modulation current
调制电流
1.
A novel hard-core circuit is presented,in which the amplitude of the modulation current is increased as the laser temperature increases,accomplished by means of a reference circuit located in "thermal proximity" to the laser.
该电路感应LD温度变化,通过设置外部电阻取值对输出调制电流的幅度、补偿温度起点以及补偿力度进行调节,从而满足LD特性随温度变化的要求,并具有良好的兼容能力。
2.
A novel circuit called temperature-dependent current switch(TDCS) circuit to implement temperature compensation for modulation current is presented.
基于对激光二极管(LD)输出光功率与流过其上的电流及温度变化关系的分析,研究了激光驱动器芯片温度补偿电路的补偿原理和实现方案,提出了一种简单新颖的称之为温控电流开关的电路,通过片外编程对输出调制电流的温度补偿起点以及补偿力度进行调节。
3.
In this paper, after the analysis of the temperature dependence of the modulation current in a direct modulated DFB LD, a novel method for modulation current temperature compensation technique has been presented in order to improve the optical transmitter performance, such as the extinction ratio and eye diagram, etc.
分析了直接调制DFB激光器的调制特性对温度的依赖特性,提出在具有背光检测功能的光发射模块中对 DFB激光器的调制电流进行温度补偿,使模块的消光比和输出光功率在器件工作温度范围内保持稳定。
3) current modulation
电流调制
1.
Based on current modulation, it can deliver leading current for compensatingthe inductive reactive power in power system by commutating the currents in coupled reactors and controlling switching on-offphase angles of the switching devices.
基于电流调制作用 ,通过耦合电感间的换流与开关器件通断相位角的控制 ,该装置可输出超前电压的电流 ,以补偿电网中常见的感性无功。
5) Flow Plating Technology (FPT)
电刷镀流镀
6) DC plating
直流电镀
1.
This article described the technical innovation and development of PCB industry, especially in DC plating and surface finish zone , which impetused the PCB industry development.
文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展。
2.
Aiming at the technology demand of advanced copper interconnect,the properties of electrodeposited copper film and parameters such as resistivity,texture coefficient,grain size and surface roughness were investigated by DC plating and pulse plating respectively.
实验结果表明,在相同电流密度条件下,脉冲电镀所得Cu镀层电阻率较低,表面粗糙度较小,表面晶粒尺寸和晶粒密度较大,而直流电镀所得镀层(111)晶面的择优程度优于脉冲。
补充资料：标准冲击电流波形(见冲击电流发生器)
标准冲击电流波形(见冲击电流发生器)
standard impulse current wave form
blaozhun ehonglld}0n4一u box]ng标准冲击电流波形(standard impulse currentwave form)见冲击电流发生器。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条