1) SIP
封装内的系统
1.
Through the analysis and comparison of SOC,MCM,SIP and SOP,this paper presents the prominent advantages of SOP technology,which makes it more suitable for the future electronic system.
通过对单芯片系统(SOC)、多芯片组件(MCM)、封装内的系统(SIP)和单封装系统(SOP)几种重要封装技术的分析比较,展示了SOP技术的显著优势,其优势使之更加适用于未来电子系统的发展。
2) Packaging
封装
1.
State-of-art in Simulation of Brazing Packaging for Miniaturized Multi-channel Heat Exchanger;
微小型多通道换热器钎焊封装仿真研究现状
2.
Thermal Conductive High Performance Polymer Microelectronic Packaging Material(Ⅰ):Preparation of the Packaging Material;
导热型高性能树脂微电子封装材料之一:封装材料的制备
3) encapsulation
封装
1.
Encapsulation and Catalytic Activity of Lipophilic Soluble Metallophthalocyanine Derivative in MCM-41;
脂溶性金属酞菁衍生物在介孔分子筛中的封装及其催化性质研究
2.
The Encapsulation and Application of Workflow System in Manufacturing Grid;
制造网格环境下工作流系统的封装和应用
3.
Portalet-based encapsulation for CAx software;
基于Portalet的CAx软件封装研究
4) Package
封装
1.
Simulation on temperature Held and materials optimization of high-power white LED package;
大功率白光LED封装温度场模拟及材料优化
2.
CMOS thermal wind sensor and its package;
CMOS工艺实现的热风速传感器及其封装
3.
Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package;
芯片叠层球栅阵列尺寸封装的焊球疲劳寿命预测
5) encapsulate
封装
1.
Meanwhile a complex process is encapsulated to allow simple code in the actual implementation of the object.
论述如何用子类处理方法,捕获Windows系统传递到窗口的命令,进而生成带自定义图标的菜单;同时封装一个复杂过程,允许原消息处理函数实际执行命令以简化代码。
2.
This program can encapsulate some system protocol,provide up-application with uniform interface,be easily used.
该通用通讯程序能够封装多种底层协议,为上层应用提供统一的调用接口,方便使用。
6) encapsulating
封装
1.
Optimization and Encapsulating of Small Object Memory Allocation in C++;
C++中小对象内存分配的优化与封装
2.
Research progress in metal encapsulating ceramic composite armors;
金属封装陶瓷复合装甲研究进展
3.
Research on encapsulating method of FBG(Fiber Bragg Grating) sensor showed significant value for FBG application in strain and temperature measurement.
封装方法的研究对于光纤光栅传感有着重要的意义。
参考词条
补充资料：人的内分泌系统人体主要内分泌腺
李瑞端绘
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说明：补充资料仅用于学习参考，请勿用于其它任何用途。