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1)  DC plating
直流电镀
1.
This article described the technical innovation and development of PCB industry, especially in DC plating and surface finish zone , which impetused the PCB industry development.
文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展。
2.
Aiming at the technology demand of advanced copper interconnect,the properties of electrodeposited copper film and parameters such as resistivity,texture coefficient,grain size and surface roughness were investigated by DC plating and pulse plating respectively.
实验结果表明,在相同电流密度条件下,脉冲电镀所得Cu镀层电阻率较低,表面粗糙度较小,表面晶粒尺寸和晶粒密度较大,而直流电镀所得镀层(111)晶面的择优程度优于脉冲。
2)  new-DC plating
新型直流电镀
3)  asymmetric AC-DC electroplating
不对称交流-直流电镀
1.
In order to increase the hardness and wear resistance of electroplated iron coating,low temperature iron plating in a chloride bath using asymmetric AC-DC electroplating technology was used to prepare Fe/nano-ZrO2 composite coating,with nano-ZrO2 being the second phase particiulates.
结果表明,采用不对称交流-直流电镀方法可获得内应力小、光滑致密的复合镀层,有效降低镀层裂纹的产生;通过控制工艺参数可调节镀层中ZrO2纳米粒子的复合量;在镀液中加入阴离子型表面活性剂十二烷基硫酸钠可降低纳米粒子的团聚,获得最佳的镀层综合性能。
4)  electroplating dynamo
电镀用直流发电机
5)  DC plating
直流镀
1.
The comparison between the influences of pulse electroplating and DC electroplating on tungsten coating shows that pulse electrodeposition can enlarge the range of current density and is superior to DC plating in the surface morphology,thickness,crystallization and deposition state,purity of the obtained tungsten coating while the composition of plating solution is the same.
在耐热钢基体上用Na2WO4-ZnO-WO3体系熔盐镀钨,比较了脉冲镀与直流镀对钨镀层性能的影响。
6)  DC brush
直流刷镀
1.
and compared the pulse brush -film with the DC brush -film, the results show that the property of the pulse brush -film is better than that of DC brush -film.
应用MSD—3O—S逆变电源及普通刷镀电源,研究了脉冲刷镀层的沉积速度、硬度、耐磨性、结合强度等方面的性能,并与直流刷镀层进行了比较,结果表明脉冲刷镀层性能优于直流刷镀层。
补充资料:宝山钢铁(集团)公司冷轧带钢厂电镀锌生产线


宝山钢铁(集团)公司冷轧带钢厂电镀锌生产线


  宝山钢铁(集团)公司冷轧带钢厂电镀锌生产线
  
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