1) direct current plating
直流镀锌
2) continuous vertical galvanizing line(CVGL)
垂直热镀锌
3) galvanize
[英]['ɡælvənaɪz] [美]['gælvə'naɪz]
电镀，镀锌，通电流
4) DC plating
直流镀
1.
The comparison between the influences of pulse electroplating and DC electroplating on tungsten coating shows that pulse electrodeposition can enlarge the range of current density and is superior to DC plating in the surface morphology,thickness,crystallization and deposition state,purity of the obtained tungsten coating while the composition of plating solution is the same.
在耐热钢基体上用Na2WO4-ZnO-WO3体系熔盐镀钨,比较了脉冲镀与直流镀对钨镀层性能的影响。
5) DC brush
直流刷镀
1.
and compared the pulse brush -film with the DC brush -film, the results show that the property of the pulse brush -film is better than that of DC brush -film.
应用MSD—3O—S逆变电源及普通刷镀电源,研究了脉冲刷镀层的沉积速度、硬度、耐磨性、结合强度等方面的性能,并与直流刷镀层进行了比较,结果表明脉冲刷镀层性能优于直流刷镀层。
6) DC plating
直流电镀
1.
This article described the technical innovation and development of PCB industry, especially in DC plating and surface finish zone , which impetused the PCB industry development.
文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展。
2.
Aiming at the technology demand of advanced copper interconnect,the properties of electrodeposited copper film and parameters such as resistivity,texture coefficient,grain size and surface roughness were investigated by DC plating and pulse plating respectively.
实验结果表明,在相同电流密度条件下,脉冲电镀所得Cu镀层电阻率较低,表面粗糙度较小,表面晶粒尺寸和晶粒密度较大,而直流电镀所得镀层(111)晶面的择优程度优于脉冲。
补充资料：直流
直流
Direct current
直流(direet。urrent) ，仅按一个方向流过电路或设备的电流称为直流。与交流电压相比，直流电压的极性是不变的。直流电流相当于电荷沿着闭合的电路以不变的方向流动或位移。直流电流和电压的幅值可以恒定，也可以随时间变化。 蓄电池和旋转发电机产生幅值恒定的额定直流电压，整流器产生幅值随时间而变的直流电压。整流器把交流电压变换为脉动的直流电压。 通常电站不是广泛地将直流电输配给一般用户，相反，在需要直流电(d。)能的场所，是把商业上合用的交流电(ac)能整流为直流电能。 「罗布(D.D.Robb)撰]
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条