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1)  PEM
塑封器件
1.
The Failure of PEM Caused by the Mismatch of CTE;
热膨胀系数不匹配导致的塑封器件失效
2.
PEMs are reputed to offer significant cost,availability,size and weight advantages,but someone still focuses on reliability issues.
但是还是有相当一部分人对于塑封器件的可靠性持怀疑态度。
3.
Based on this, high accelerate stress test (HAST) were done to evaluate the reliability of PEM devices, the proposal from Goddard center of NASA which screen the high reliability PEM devices were introduced.
针对影响塑封器件可靠性的五种失效机理,即腐蚀失效、爆米花效应、低温/温冲失效、闩锁以及工艺缺陷等方面进行分析和讨论,并提出利用高温潮热和温度冲击试验对塑封器件的可靠性进行评估。
2)  plastic encapsulated microcircuits (PEM)
塑封器件
1.
With the persistent improvements in quality and reliability, the application of plastic encapsulated microcircuits (PEM) became more widespread, even including the military field.
随着塑封器件(PEMs)质量和可靠性的不断提高,塑封器件的应用领域进一步扩展,也逐步应用于军事领域。
3)  Plastic Packaging Device
塑封器件
1.
Influence of combining thermal-humidity and vapor pressure on the reliability for plastic packaging device
集成湿热及蒸汽压力对塑封器件可靠性的影响
4)  plastic packaging QFN device
塑封QFN器件
5)  plastic device
塑料封装器件
6)  plastic electronic packaging component
电子模塑封器件
补充资料:挤塑吹塑
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性质: 由挤出机挤出管状型坯,并将它垂挂在安装于挤出机头正下方的预先打开的模具型腔中。当下垂的型坯达到合格长度后立即合模,靠模具的切口将管坯切断,然后通过从模具分型面上的小孔插入的压缩空气吹管送入压缩空气,使型坯吹胀紧贴模壁而成型,然后脱模即成制品。

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