From the points of view of lead frame design, processing accuracy control, inner packaging material choosing, desired inner packaging shape control, the realizing of molding air-tightness and the perfection of environmental condition, the article discussed the design and process key points on raising the isolation voltage to develop world advanced-level product and to form volume pr.

In this thesis, molding process for a typical TSOP product is studied in detail, and FEA(Finite element analysis) has been applied in this process.

Also the way to solve the issue of package-chipping,such as improving the structure of molding tooling design,lead frame,the direction of D/T(Such as inverted punch and body supporting) ,promoting the characteristic of the compound and molding tooling will be shared.

Development of the automatic loader system for plastic package of integrated circuit;

Study on autolead frame load technology for plastic package of integrated circuit;

Design of plastic package die with multi-injection head for integrated circuit;

The difference between ball grid array(BGA) and conventional plastic package die for integrated circuit product was analyzed.

The theory for design of the air-blow of the encapsulating mould is introduced.

Traditional epoxy molding compounds are facing great challenges for both of the voice from ever-rising environmental protection and the needs of improving property of electronic encapsulating materials for integrated circuit industry.

Analysis of the force of encapsulating molding;