1) Micro solder ball bonding
微钎料球键合
2) microcrystalline brazing alloy
微晶钎料
1.
High frequency brazing of 0Cr18Ni9Nb to YG6 using Cu-based microcrystalline brazing alloys;
Cu基微晶钎料高频钎焊0Cr18Ni9Nb/YG6分析
2.
The vacuum brazing of 25Cr3MoA steel and YG6 cemented carbide was conducted by using a Cu-11%Sn-2%Ni microcrystalline brazing alloy.
应用Cu 11%Sn-2%Ni微晶钎料对25Cr3MoA钢和YG6硬质合金进行了真空钎焊,观察了接头组织形貌,建立了钎料层/母材原子互扩散模型,定量分析了焊接区合金元素的分布特征,并在专用仪器上测试了接头的剪切强度。
3.
In this paper, high-frequency induction brazing of YG6 to 0Crl8Ni9Nb and vacuum brazing of YG6 to 25Cr3MoA were conducted by using Cu-based microcrystalline brazing alloy foils.
本文应用铜基微晶钎料箔分别对YG6/0Cr18Ni9Nb、YG6/25Cr3MoA进行了高频钎焊和真空钎焊试验研究。
3) brazing alloy
钎料合金
1.
Effect of alloying elements on microstructure and property of AgCuZnSn brazing alloy;
合金元素对AgCuZn系钎料合金组织与性能的影响
2.
Effect of P and rare-earth La on microstructure and property of AgCuZnSn brazing alloy;
P,稀土La对AgCuZnSn钎料合金组织与性能的影响
3.
The melting temperature was measured by a microscale DTA analyzer and the microstructure and welding performance of the brazing alloy were studied by metallographic and SEM analysis together with X-ray energy spectrum analysis.
使用微量型DTA差热分析仪测定钎料合金的熔化温度,并通过金相观察和扫描电镜观察结合X射线能谱分析对钎料合金的组织和焊接性能进行研究。
4) solder alloy
钎料合金
1.
Design of lead-free solder alloy and alloy phase diagram calculation;
无铅锡基钎料合金设计和合金相图及其计算
2.
5Ag solder alloy and conducted under different loading waveforms at room temperature.
5Ag钎料合金进行了不同加载波形下的单轴应变循环实验。
3.
7Cu solder alloy is selected out by comprehensive comparison.
7Cu系钎料合金为基础,添加少量的RE,研究RE添加量对合金组织、力学及物理性能的影响,以确定最佳RE添加量。
5) composite solder
复合钎料
1.
Effect of content of Ag particles on properties of SnCu based composite solder;
Ag颗粒含量对SnCu基复合钎料性能的影响
2.
Interfacial reaction of Sn-9Zn/Cu joint with Cu particle-reinforced composite solder Sn-9Zn;
Cu颗粒增强的Sn-9Zn复合钎料/Cu钎焊接头界面反应
3.
Study on nanon-sized Ag particles enhanced composite solder;
纳米银颗粒增强复合钎料的研究
6) Sn2.5Ag0.7CuXRE solder alloy
Sn2.5Ag0.7CuXRE钎料合金
补充资料：可降解淀粉微球和生物降解白蛋白微球阻滞法
可降解淀粉微球和生物降解白蛋白微球阻滞法
介入放射学技术。介入性局部化疗之前，把二者注入靶动脉，可暂时减少动脉血流，再行化疗药物灌注，以减少血液冲刷，保持局部化疗药物浓度的技术。与其他中期和长期栓塞微球不同，DSM和BAM仅造成数十分钟的血流量减少，待其被降解后血流可恢复至以前水平。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条