2) Silicon/silicon bonding
硅/硅键合
1.
The research of resonance pressure sensor technology has been done by used silicon/silicon bonding, grinding and IC process, the compatible technology problems of three- dimension bulk manufacturing and planar IC process have been resolved.
文章利用硅/硅键合、减薄抛光和IC工艺技术,开展硅基谐振型压力传感器技术研究,解决了三维体加工与IC工艺兼容的关键技术问题,成功地研制出一种硅基谐振型压力传感器样品,在常压下测试其Q值达到400,进一步参数测试还在进行中。
3) Wafer to wafer bonding
硅-硅键合
4) bonded silica gel
键合硅胶
1.
The structure of this bonded silica gel was precisely illustrated in terms of the instrumental analysis results.
介绍 1 -( 4 -偶氮苯基 ) -3-丙基 -三氮烯键合硅胶 ( ABPT-SG)的合成方法 ,并利用红外吸收光谱法、元素分析法、差热分析法、紫外 -可见光谱法对其结构进行了表征。
2.
qbsorption speed and absorbed amount are studbed for the adsorption of 5organic dyes (methylene blue, light green, intrazan red, basic violet and astralon green) on methyl (phenylethyl) bonded silica gel in aqueous solutions with 0.
2MNaCl水溶液中亚甲兰、亮绿、中性红、品红和孔雀石绿在甲基（苯乙基）键合硅胶上的吸附速率曲线和等温线。
5) bonded silica
键合硅胶
1.
The bonded silica was characterized by three methods (Fourier transform infrared spectrogram, Molish color reaction, X-ray optical electrical energy spectrogram).
为了提高环糊精键合固定相的立体选择性,以γ-(2,3-环氧丙氧基)丙基三甲氧基硅烷为连接臂,合成了2,6-二-O-苄基-β-CD键合硅胶固定相(BCDS);利用傅里叶红外光谱、X射线光电子能谱、莫氏(Molisch)试验颜色反应进行了表征;以邻苯二甲酸二甲酯、甲苯和菲为测试溶质,评价了该键合固定相的色谱性能;考察了该固定相对位置异构体的分离效果,硝基苯胺、苯二酚等的位置异构体在新合成的键合固定相上得到了很好的分离。
2.
Heptakis (2,6-di-O-butyl)-β-cyclodextrin bonded silica stationary phase was prepared and separately characterized by IR, XPS and Molisch color reaction.
合成了七(2,6-二-O-丁基)-β-环糊精键合硅胶固定相;采用红外光谱、X射线光电子能谱、莫氏(Molisch)颜色试验对其进行了表征。
3.
The resulting bonded silica has been characterized by various methods.
合成对联苯二酚桥联环糊精键合硅胶固定相;利用傅里叶红外光谱、X射线光电子能谱、莫氏(Molisch)颜色实验进行了表征;以邻苯二甲酸二甲酯、甲苯和菲为测试溶质,评价该键合固定相的色谱性能,并考察了该固定相对一些位置异构体的色谱分离效果;讨论了可能的分离机理。
6) goldsilicon bonding
金硅键合
1.
At the same time,two experiments of anodic bonding and goldsilicon bonding were carried out on the equipment,and the samples of the experiments have no defect and have good capability of combination,which proved the practicability of the equipment.
在该设备的基础上,进行了阳极键合与金硅键合2种典型的键合试验,键合出来的样品结合强度高而且没有缺陷,验证了该设备的实用性。
补充资料：二氯二甲基硅烷与二氯二苯基硅烷、三氯甲基硅烷、三氯苯基硅烷和三氯苯基硅烷的聚合物
CAS：28630-33-3
分子式：(C12H10Cl2Si·C6H5Cl3Si·C2H6Cl2Si·CH3Cl3Si)x
中文名称：二氯二甲基硅烷与二氯二苯基硅烷、三氯甲基硅烷、三氯苯基硅烷和三氯苯基硅烷的聚合物
英文名称：Silane, dichlorodimethyl-, polymer with dichlorodiphenylsilane, trichloromethylsilane and trichlorophenylsilane silane, dichlorodimethyl-, polymer with dichlorodiphenylsilane, trichloromethyl
分子式：(C12H10Cl2Si·C6H5Cl3Si·C2H6Cl2Si·CH3Cl3Si)x
中文名称：二氯二甲基硅烷与二氯二苯基硅烷、三氯甲基硅烷、三氯苯基硅烷和三氯苯基硅烷的聚合物
英文名称：Silane, dichlorodimethyl-, polymer with dichlorodiphenylsilane, trichloromethylsilane and trichlorophenylsilane silane, dichlorodimethyl-, polymer with dichlorodiphenylsilane, trichloromethyl
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条