1) aluminum-silicon bonding wire
键合硅铝丝
1.
Si and impurity elements of Fe and Cu in aluminum-silicon bonding wires were determined by inductively coupled plasma a-tomic emission spectrometry.
该方法应用于快速测定键合硅铝丝中的各种元素,结果满意。
2) thick aluminum wire wedge bonding
粗铝丝引线键合
1.
The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.
试验研究了不同超声功率条件下,键合时间对粗铝丝引线键合强度的影响规律。
4) Al-Si wire
铝硅焊丝
6) Silicon/silicon bonding
硅/硅键合
1.
The research of resonance pressure sensor technology has been done by used silicon/silicon bonding, grinding and IC process, the compatible technology problems of three- dimension bulk manufacturing and planar IC process have been resolved.
文章利用硅/硅键合、减薄抛光和IC工艺技术,开展硅基谐振型压力传感器技术研究,解决了三维体加工与IC工艺兼容的关键技术问题,成功地研制出一种硅基谐振型压力传感器样品,在常压下测试其Q值达到400,进一步参数测试还在进行中。
补充资料：-[1,1,3,3-四苯基-1,3-二硅烷二醇合]二铝
CAS：81422-13-1
分子式：C88H52Al2N16O3Si2
中文名称：二[29H,31H-酞菁合,N29,N30,N31,N32][μ-[1,1,3,3-四苯基-1,3-二硅烷二醇合]二铝
英文名称：bis[29H,31H-phthalocyaninato-N29,N30,N31,N32][μ-[1,1,3,3-tetraphenyl-1,3-disiloxanediolatoAluminum
分子式：C88H52Al2N16O3Si2
中文名称：二[29H,31H-酞菁合,N29,N30,N31,N32][μ-[1,1,3,3-四苯基-1,3-二硅烷二醇合]二铝
英文名称：bis[29H,31H-phthalocyaninato-N29,N30,N31,N32][μ-[1,1,3,3-tetraphenyl-1,3-disiloxanediolatoAluminum
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条