1) APCVD
常压化学气相淀积
1.
Computer Simulation of Polysilicon Films Prepared by APCVD;
常压化学气相淀积多晶硅的计算机模拟
2.
Using a SiH4-C3H8-H2 reaction gas system,polycrystal 3C-SiC films have been grown on Si(100) substrates with different porous silicon buffers via atmospheric pressure chemical vapor deposition(APCVD) process.
采用SiH4-C3H8-H2气体反应体系,通过常压化学气相淀积(APCVD)工艺在电化学腐蚀的多孔硅衬底上进行了多晶3C-SiC薄膜的生长,研究了多孔硅孔隙率对薄膜生长质量的影响。
2) atmospheric pressure chemical vapor deposition (APCVD)
常压化学气相淀积(APCVD)
3) LPCVD
低压化学气相淀积
1.
Research on Polysilicon Thin Film Technics by LPCVD;
低压化学气相淀积多晶硅薄膜工艺研究
2.
MOLECULAR DYNAMICS SIMULATION OF THE THICKNESS OF POLYCRYSTALLINE Si MEMBRANE PREPARED BY LPCVD;
低压化学气相淀积多晶硅薄膜膜厚的分子动力学模拟
3.
The internal stress in silicon-nitride thin films prepared by low-pressure chemical vapor deposition(LPCVD) was studied measured by XP-2 stylus profilometer.
研究了低压化学气相淀积SiN(LPCVD)介质薄膜的内应力,采用XP-2型台阶仪测量了SiN介质薄膜的内应力,通过改变薄膜淀积时的工艺参数,观察了反应气体流量比、淀积温度、反应室压力等因素对SiN薄膜内应力的影响。
4) VLP-CVD
超低压化学气相淀积
1.
Temperature Dependence of Self organized Growth of Ge Quantum Dots on Si Substrate by VLP-CVD;
对利用超低压化学气相淀积 (VLP CVD)技术在Si上自组织生长Ge量子点的特征进行了研究 ,发现生长温度对Ge量子点尺寸分布和密度的影响不同于分子束外延 (MBE)的结果 ,这种现象与VLP CVD表面控制反应模式有关。
5) APCVD
常压化学气相沉积
1.
Preparation of self-cleaning glass coated with TiO_2 on a float glass line by APCVD method
在线常压化学气相沉积方法制备TiO_2自洁薄膜玻璃(英文)
2.
TiN films were coated on glass substrates by atmospheric pressure chemical vapor deposition(APCVD) under different growth conditions,including different substrate temperatures and a gaseous mixture of varying chemical concentrations.
本研究以TiCl4和NH3为反应气体,N2为保护气氛,用常压化学气相沉积法(APCVD)在玻璃基板上沉积制备得到了一系列不同反应温度和原料浓度的TiN薄膜。
3.
N-doped TiO_2 films were grown by atmospheric pressure chemical vapor deposition(APCVD) with TiCl_4 and NH_3 as precursors.
用常压化学气相沉积(APCVD)法,以四氯化钛(TiCl4)、氧气(O2)和氨气(NH3)作为气相反应先驱体,成功制备了掺氮二氧化钛(TiO2)薄膜。
6) atmospheric pressure chemical vapor deposition
常压化学气相沉积
1.
Titanium nitride(TiN)films were prepared by the atmospheric pressure chemical vapor deposition process using titanium tetrachloride and ammonia as reactive gases.
以TiCl4和NH3为原料,用常压化学气相沉积法在玻璃基板表面沉积得到了TiN薄膜。
2.
TiO_2/SnO_2:F composite films were deposited by atmospheric pressure chemical vapor deposition with Ti(OC_3H_7)_4 as pre- cursors and SnO_2:F coated glass as substrates.
以Ti(OC_3H_7)_4为先驱体,SnO_2:F镀膜玻璃为基板,采用常压化学气相沉积法制备了TiO_2/SnO_2:F复合薄膜。
补充资料：化学气相淀积
英文:cvd(chemical vapor deposition)
指把含有构成薄膜元素的气态反应剂或液态反应剂的蒸气及反应所需其它气体引入反应室，在衬底表面发生化学反应生成薄膜的过程。在超大规模集成电路中很多薄膜都是采用cvd方法制备。
化学气相淀积特点：淀积温度低，薄膜成份易控，膜厚与淀积时间成正比，均匀性，重复性好，台阶覆盖性优良。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条