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说明：双击或选中下面任意单词，将显示该词的音标、读音、翻译等；选中中文或多个词，将显示翻译。
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1) thermosonic flip chip bonding
热超声倒装键合
1.
Vibration frequency characters of chip and bonding on thermosonic flip chip bonding;
热超声倒装键合工具和芯片振动的频率特征
2.
Formation of circle band interface of thermosonic flip chip bonding;
热超声倒装键合环状界面的形成
2) thermosonic flip-chip bonding
热超声倒装键合
1.
To eliminate the influence of temperature on the alignment precision of chips and substrates in the process of thermosonic flip-chip bonding,the image dithering caused by heating must be controlled in sub-pixel scope.
为消除温度在热超声倒装键合过程中芯片与基板对准精度的影响,必须将因键合加热而引起的图像抖动量控制在亚像素范围内。
2.
To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
热超声倒装键合作为前沿封装技术具有良好的发展前景。
3) thermosonic flip chip bonding
热超声倒装
1.
The thermosonic flip chip Bonding technology becomes focus of studying, which can increase the density of pac.
微电子技术的发展，要求芯片具有更小的尺寸、更多的I／O、更高的性能和可靠性，这对芯片封装装备提出了更大的挑战，面阵列封装技术迎合了这一发展趋势，热超声倒装键合是一种绿色无铅面阵列封装技术，是最具有潜力的下一代封装技术之一。
4) thermosonic bonding
热超声键合
1.
Dynamic characteristics study of piezoelectric transducer for thermosonic bonding;
热超声键合压电换能器的动力学特性
2.
The system of the ultrasonic transducer is the key component of the bonding equipment in the thermosonic bonding system.
在热超声键合系统中,超声换能系统是键合装备的核心部分。
5) thermosonic bonding process
热超声键合
1.
This investigation is to determine the effect of temperature on bonding strength, impedance and power of PZT transducer in thermosonic bonding process.
在有规律地改变键合温度的条件下,分析不同温度对热超声键合工艺连接强度的影响规律,并研究温度因素对整个系统的PZT换能器输入功率及阻抗的影响。
6) Thermosonic-bonding
热超声球键合
补充资料：UG 热键
Application 对应菜单功能
F1 Help -> Context…
F3 View -> Current Dialog
F4 View -> Information
F5 View -> Refresh Ctrl- A View -> Assembly Navigator
Ctrl-Shift- A File -> Save As…
Ctrl- B Edit -> Blank -> Blank…
Ctrl-Shift- B Edit -> Blank -> Reverse Blank All
Ctrl-Alt- B Manufacturing Tools -> Boundary…
Ctrl- C Edit -> Copy
Ctrl-Shift- C View -> Curature Graphs
Ctrl-Alt- C Tools -> CLSF…
Ctrl- D Edit -> Delete…
Ctrl- E Tools -> Expression…
Ctrl- F View -> Operation -> Fit
Ctrl-Shift- F Format -> Layout -> Fit All Views
Ctrl- G File -> Execute UG/Open -> Grip…
Ctrl-Shift- G File -> Execute UG/Open -> Debug Grip…
Ctrl-Shift- H View -> Visualization -> High Quatity Image
Ctrl- I Information -> Object…
Ctrl- J Edit -> Object Display…
Ctrl-Shift- J Preferences -> Object…
Ctrl-Shift- K Edit -> Blank -> Unblank Selected…
Ctrl- L Format -> Layer Settings…
Ctrl- M Application -> Modeling…
Ctrl-Shift- M View -> Model Navigator
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条
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