1.
Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding
热超声倒装键合中温度对对准精度的影响
2.
Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface;
热超声倒装键合界面运动与界面性能的生成规律研究
3.
ultrasonic heating therapy apparatus for tumor
超声肿瘤加热治疗机
4.
automatic ultrasonic testing device
自动超声波探伤装置
5.
Determination of Direction and Range
定向与测距装置(超声波)
6.
Thermal Design of Integrated Power Electronics Module Using Flip-Chip Technology
倒装芯片集成电力电子模块的热设计
7.
Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint
无铅倒装焊点的热应力与湿热应力分析
8.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
9.
Three-dimensional(3 D) ultrasound imaging has become one of the hottest research areas in medical u1 trasound.
三维超声成像是当前超声研究的一个热点。
10.
A Comparion between Slow-Speed Handpiece and Ultrasonic Instrument on Posterior Teeth in Root-End Preparation;
超声波与慢速手机后牙根尖倒预备的比较研究
11.
Research on the Deep Micro Holes Machining by EDM with USM in Inverted Layout
倒置式电火花超声复合加工深微孔的研究
12.
Detection and alarm system to reverse radar of ultrasontic sensor based on MSP430
基于MSP430单片机的超声波倒车雷达监测报警系统
13.
Design of Self-adaptive Reverse Radar Based on Ultrasonic Ranging
基于超声波测距的自适应倒车雷达设计
14.
The Research on Thermal Property and Magnetic Hysteresis Loss of Giant Magnetostrictive Materials in Power Ultrasound Transducer
超磁致伸缩功率超声换能器磁滞损耗及热分析
15.
Design of Master Computer Software in Ultrasound Hyperthermia System
超声治癌热疗系统上位机软件的设计
16.
Experimental Study and Clinical Application of Tumor Ultrasonic Heat Therapy;
肿瘤超声热疗的实验研究和临床应用
17.
Sonochemical Synthesis of Nanostructured Bi_2Te_3 Based Thermoelectric Compounds;
超声化学法合成纳米Bi_2Te_3基热电化合物
18.
Ultrasonic Thermotherapy in Tumor Treatment Temperature Fieldresearch and Two Kinds of Different Laboratory Method Temperature Field Survey;
超声热疗在肿瘤治疗中的温度场研究