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1.
Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding
热超声倒装键合中温度对对准精度的影响
2.
Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface;
热超声倒装键合界面运动与界面性能的生成规律研究
3.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
4.
Research on Nonlinear Vibration of Contact Interface in Thermosonic Bonding Transducer System
热超声键合换能系统接触界面非线性振动研究
5.
Design for Frequency-modulated Ultrasonic Generator in Ultrasonic Bonding Field
超声键合变频式超声波发生器的设计
6.
Design and Simulation of Pre-bonding System of Flip Chip Equipment for RFID Packaging;
RFID倒装键合机预贴片系统设计与仿真
7.
Research on the Key Technologies of Ultrasonic-Magnetorheological Compound Finishing;
超声波磁流变复合抛光关键技术研究
8.
Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA
基于FPGA的引线键合超声电源的研究
9.
Critical Technologies Research of the Microwave-Induced Thermo-Acoustic Tomography System
微波热致超声波扫描成像系统关键技术研究
10.
Sonochemical Synthesis of Nanostructured Bi_2Te_3 Based Thermoelectric Compounds;
超声化学法合成纳米Bi_2Te_3基热电化合物
11.
Research on the Deep Micro Holes Machining by EDM with USM in Inverted Layout
倒置式电火花超声复合加工深微孔的研究
12.
Ultrasonic Fusion Bonding for Polymer Microfluidic Chips
聚合物微流控芯片超声波熔融键合技术研究
13.
Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips
聚合物微流控芯片超声波键合方法研究
14.
Synthesis and Characterization of Intermolecular Hydrogen Bond Induced Supermolecular Liquid Crystalline Compound
氢键自组装超分子液晶复合物的合成及表征
15.
Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线键合高频超声换能器的设计和键合头运动控制研究
16.
Synthesis of MnO_2 Nanowire by Ultrasonic-assisted Hydrothermal Route
超声波辅助水热合成MnO_2纳米线
17.
Effects of Ultrasound-heating Combinatorial Treatment on Milk Quality
热-超声联合作用对牛奶品质的影响
18.
Microcosmic Mechanism and Rule of the Interfaces in Ultrasonic Bonding;
超声键合界面微结构生成机理与规律研究