1) high lead-containing solder
高铅钎料
2) high-temperature lead-free solder
高温无铅钎料
1.
People have to develop a new type of high-temperature lead-free solder to replace the high-lead solder in impendence in the electronic industry due to the harmfulness of Pb as well as its negative impact.
虽然在RoHS指令中含铅的质量分数超过85%的高熔点Sn-Pb钎料(如90Pb- 10Sn熔化温度268-301℃)因还没有找到合适的替代材料而得到豁免,但由于Pb的危害以及合金本身的负面影响,在电子工业中迫切需要研制新型高温无铅钎料来取代高铅钎料。
2.
The microstructure,joint shear strength and fracture surface of high-temperature lead-free solder Bi-xAg-0.
1Ge(x=2,5,8,11,14)高温无铅钎料/铜接头进行了界面微观组织分析、抗剪强度测试及剪切断口分析。
3) high temperature lead-free solder
高温无铅钎料
1.
Research development of high temperature lead-free solders for electronic assembly
电子组装用高温无铅钎料的研究进展
2.
, silver powder sintering and solid-liquid diffusion, and offered a review on the research of several potential high temperature lead-free solders which included Zn and Bi-Ag based solders, Bi-based composite solders and Au-based solders.
在此基础上,探讨了高温无铅钎料及高温无铅互连技术的发展趋势。
4) Lead-free Solder
无铅钎料
1.
Study of Sn-Zn Lead-free Solder by Alloying;
Sn-Zn无铅钎料合金化改性研究
2.
Study on interface and shear behavior in lead-free solder joint;
无铅钎料焊点界面与剪切行为的研究
3.
Rare earths modified Sn-58Bi low-temperature lead-free solders;
稀土改性的Sn-58Bi低温无铅钎料
5) lead-free solders
无铅钎料
1.
Advances in research and application of lead-free solders for electronic and photonic packaging;
电子和光子封装无铅钎料的研究和应用进展
2.
Compared with the traditional “Bi-Segregation” invalidation mechanism, the“three-factor method” can explain the causes of lift-off formed or non-formed by all lead-free solders with and without bismuth.
相比传统的“Bi-Segregation”失效机理,“三要素法”可以解释含Bi和不含Bi的所有无铅钎料产生或不产生Lift-off的原因,并由此找出了Lift-off的抑制对策。
3.
Because of lead poisoning in Sn-Pb solder,it is necessary for our electronicmaterial industry to develop lead-free solders.
介绍了国外近年来在无铅钎料的研究开发领域取得的一些进展,内容包括:对无铅钎料的性能要求和研究试验方法;几种正在研究开发中的无铅钎料的成分与性能。
6) Sn-Pb solder
锡铅钎料
补充资料：高温
较高的温度，在不同的情况下所指的具体数值不同，例如在某些技术上指几千摄氏度以上，在工作场所指32摄氏度以上。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条