Morphology evolution of intermetallic compounds in nickel particle reinforced lead-free composite solder;

The mechanical property and solder ability of SnAgCu system lead-free solder alloys were studied by means of optical microscopy, scanning electron microscopy(SEM), energy dispersive X-ray(EDX) and Instron electrohydraulic servo fatigue tensile tester.

Study of Sn-Zn Lead-free Solder by Alloying;

Study on interface and shear behavior in lead-free solder joint;

Rare earths modified Sn-58Bi low-temperature lead-free solders;

Advances in research and application of lead-free solders for electronic and photonic packaging;

Compared with the traditional “Bi-Segregation” invalidation mechanism, the“three-factor method” can explain the causes of lift-off formed or non-formed by all lead-free solders with and without bismuth.

Because of lead poisoning in Sn-Pb solder,it is necessary for our electronicmaterial industry to develop lead-free solders.

Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder;

With the development of electronic industry and the research of lead free solder, the requirement of high quality and low price lead free solder is urgent and the soldering reaction as well as the reliability of solder joints arouses researchers' attention.

After ten years study, researcher found that among all of the lead free solders, SnAgCu solder is the most possible solder to replace tin lead solder.