1) indium solder-bump
In焊凸点
1.
By using the thermal cycle equipment(TCE-a) developed by SITP,the vaccum environment and stirling cooler\'s intermittent working modes were simulated,and two failure modes of indium solder-bump were discovered.
利用中科院上海技术物理研究所研制的温度循环设备TCE-a,模拟了真空环境下的斯特林制冷机的开关机模式,发现了In焊凸点的两种失效模式。
2) Solder bump
焊料凸点
1.
In this paper, a low cost flip chip interconnection is introduced, which electrolessNi as the under bump metallurgy (UBM), deposits solder paste using stencil printing, and reflowsthe paste to form solder bumps.
回顾了低成本制备芯片上焊料凸点的方法,即化学镀镍制备凸点下金属层、模版印刷焊料,最后回流形成焊料凸点,并综述了该方法的最新研究进展。
3) Bumps
凸焊点
1.
The Research and Development of Vertical Fountain Plating for Making Bumps in Wafer Level Package;
制作圆片级封装凸焊点的垂直喷镀机研制
4) multiple projection welding
多点凸焊
5) bonding pedestal
焊接凸点
6) projection welding
凸焊;多点凸焊
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条