1) bump
[英][bʌmp] [美][bʌmp]
凸点
1.
The progress of electromigration in bump interconnect;
倒装芯片互连凸点电迁移的研究进展
2.
The interface structures of solder droplet for SnPb and SnAgCu Al/Ni/Cu pad were investigated by droplet direct laser fabrication method,which is compared with the interface structures for bump and pad under laser reflow bumping.
采用熔滴直接凸点制作方法,对共晶SnPb及SnAgCu钎料熔滴与Au/Ni/Cu焊盘所形成的凸点/焊盘界面组织进行了研究,并与激光重熔条件下获得的凸点/焊盘界面组织进行了比较,考察了凸点/焊盘界面组织在随后的再重熔过程中的演变。
2) convex points
凸点
1.
An improved algorithm of convex hull based on the super ball’s lamella is proposed in terms of the character that only the outmost points of the convex set may be the convex points and the points nearby the center of the convex set can not be ones.
根据凸集中只有最外围的点才有可能是凸点而中心附近的点不可能成为凸点的特性,提出了一种基于超球外壳的凸包改进算法。
2.
In convex hull,some points in the convex hull,such as the points lie in the line between the two convex points but not convex points.
在凸包中,位于两凸点之间直线上点也在凸包上,但不是凸点,如何寻找凸点是凸包算法的关键。
3) salient point
凸点
1.
Computing global color feature by at the extracting color information location of salient point can optimally capture local image information, and be more robust for detecting the change of orientation along image contour Experiment shows such an approach can improve significantly retrieval result
通过在凸点的位置提取色彩信息来计算全局色彩特征能够较好地捕捉局部图像信息 ,对角度的变化更具鲁棒性 实验结果表明 ,应用文中方法计算全局色彩特征 ,可以明显地改进检索效
4) solder bumping
凸点
1.
Some "solder bumping" setup on the LTCC circuit substrate grounding so.
在LTCC电路基板接地面设置(Ni+M)复合金属膜层,根据试验测试比较,其耐焊性(>600s)明显优于常规金属化接地层(常规要求>50s);在LTCC电路基板的接地面的一端预置"凸点",通过X射线扫描图对比分析,增加"凸点"的设计提高了大面积接地钎焊的钎着率。
5) solder bump
凸点
1.
Experiments were carried out to investigate an area-array SnAg alloy electroplating solder bumping process with a bump size of less than 100μm.
微尺寸SnAg凸点的制备技术及其互连可靠性
2.
With the rapid development of electronic packaging technology and the rise of the lead free trend, the research of reaction between solder bump and under bump metallurgy(UBM)becomes a hot topic in flip chip tech- nology.
随着当代电子封装技术的飞速发展以及无铅化潮流的兴起,倒装芯片中凸点(Solder Bump)与凸点下金属层(UBM)之间的反应的研究成为当前研究的热点。
6) gold bump
金凸点
1.
Fine pitch ECD gold bumping towards future demands;
面向未来需求的细间距电化学沉积金凸点工艺(英文)
2.
Research of gold bump for wafer level package;
用于圆片级封装的金凸点研制
3.
Gold bump bonding process is used for raising bond wire.
金凸点键合工艺用于提高国产陶瓷外壳键合指 上的键合引线强度有非常明显的效果,是一项较新的技术。
补充资料：凸凸
1.高出貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条