2) Lead-free Solder
无铅钎料
1.
Study of Sn-Zn Lead-free Solder by Alloying;
Sn-Zn无铅钎料合金化改性研究
2.
Study on interface and shear behavior in lead-free solder joint;
无铅钎料焊点界面与剪切行为的研究
3.
Rare earths modified Sn-58Bi low-temperature lead-free solders;
稀土改性的Sn-58Bi低温无铅钎料
3) lead-free solders
无铅钎料
1.
Advances in research and application of lead-free solders for electronic and photonic packaging;
电子和光子封装无铅钎料的研究和应用进展
2.
Compared with the traditional “Bi-Segregation” invalidation mechanism, the“three-factor method” can explain the causes of lift-off formed or non-formed by all lead-free solders with and without bismuth.
相比传统的“Bi-Segregation”失效机理,“三要素法”可以解释含Bi和不含Bi的所有无铅钎料产生或不产生Lift-off的原因,并由此找出了Lift-off的抑制对策。
3.
Because of lead poisoning in Sn-Pb solder,it is necessary for our electronicmaterial industry to develop lead-free solders.
介绍了国外近年来在无铅钎料的研究开发领域取得的一些进展,内容包括:对无铅钎料的性能要求和研究试验方法;几种正在研究开发中的无铅钎料的成分与性能。
4) lead free solder
无铅钎料
1.
Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder;
Sn-Zn-Cu无铅钎料的组织、润湿性和力学性能
2.
With the development of electronic industry and the research of lead free solder, the requirement of high quality and low price lead free solder is urgent and the soldering reaction as well as the reliability of solder joints arouses researchers' attention.
随着电子工业的发展和无铅钎料研究的深入,对于高性能、低成本的无铅钎料的需求愈加迫切,而钎焊反应和焊点可靠性已成为当前研究的热点。
3.
After ten years study, researcher found that among all of the lead free solders, SnAgCu solder is the most possible solder to replace tin lead solder.
通过近十年的研发,研究者们发现:在众多无铅钎料中,SnAgCu钎料最有可能成为SnPb铅料的替代品。
5) low silver brazing filler
低银钎料
1.
The effects of Sn & P on the brazing properties of low silver brazing filler metal is studied.
:针对Sn和P对低银钎料的钎焊性能的影响进行了研究 ,发现Sn和P的添加使低银钎料的熔点降低 ,Sn的添加同时使低银钎料的钎焊性能变好。
6) soldering/lead free solder alloy
钎焊/无铅钎料
补充资料：低银
1.成色低的银子。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条