1.
The Development and Study of Low Ag Sn-0.3Ag-0.7Cu-XBi Lead-free Solder;
Sn-0.3Ag-0.7Cu-XBi低银无铅钎料的开发与研究
2.
Effect of Bi on Microstructure and Propertities of Sn-0.3Ag-0.7Cu Solder
Bi对低银无铅钎料Sn-0.3Ag-0.7Cu接头组织和性能的影响
3.
Investigation on Low Temperature Sn-Zn Base Lead-Free Solder Alloys
低熔点Sn-Zn系无铅钎料的研究
4.
Effect of Cerium on Property and Microstructure for SnAgCu Lead Free Solder;
稀土铈对锡银铜无铅钎料组织性能的影响
5.
Multiaxial Ratcheting Deformation and Low Cycle Fatigue of Lead-free Solder Sn-3.5Ag;
无铅钎料Sn-3.5Ag多轴棘轮变形与低周疲劳研究
6.
Microstructures and mechanical properties of Sn-30Bi-0.5Cu low-temperature lead-free solder
Sn-30Bi-0.5Cu低温无铅钎料的微观组织及其力学性能
7.
Investigation on Microstructure and Properties of Low Silver-Containing Cadmium-Free Intermediate Temperature Brazing Filler Metals;
新型低银无镉中温钎料组织性能的研究
8.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
9.
Research on the New Lead-Free Solder Processing Properties of Brazing and Mechanical Properties;
新型无铅钎料钎焊工艺性及机械性能的研究
10.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
11.
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
SnAgCu系无铅钎料合金力学性能及钎焊性能研究
12.
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
13.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
14.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
15.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
16.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
17.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
18.
The Study of the Effect of Sb on Sn-0.7Cu Lead-free Solder;
Sb对Sn-0.7Cu无铅钎料性能影响的研究