People have to develop a new type of high-temperature lead-free solder to replace the high-lead solder in impendence in the electronic industry due to the harmfulness of Pb as well as its negative impact.

The microstructure,joint shear strength and fracture surface of high-temperature lead-free solder Bi-xAg-0.

Research development of high temperature lead-free solders for electronic assembly

, silver powder sintering and solid-liquid diffusion, and offered a review on the research of several potential high temperature lead-free solders which included Zn and Bi-Ag based solders, Bi-based composite solders and Au-based solders.

Study of Sn-Zn Lead-free Solder by Alloying;

Study on interface and shear behavior in lead-free solder joint;

Rare earths modified Sn-58Bi low-temperature lead-free solders;

Advances in research and application of lead-free solders for electronic and photonic packaging;

Compared with the traditional “Bi-Segregation” invalidation mechanism, the“three-factor method” can explain the causes of lift-off formed or non-formed by all lead-free solders with and without bismuth.

Because of lead poisoning in Sn-Pb solder,it is necessary for our electronicmaterial industry to develop lead-free solders.

Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder;

With the development of electronic industry and the research of lead free solder, the requirement of high quality and low price lead free solder is urgent and the soldering reaction as well as the reliability of solder joints arouses researchers' attention.

After ten years study, researcher found that among all of the lead free solders, SnAgCu solder is the most possible solder to replace tin lead solder.