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1)  Epoxy sheet molding compound
环氧片状模塑料
1.
Epoxy sheet molding compound(ESMC) is a kind of new compressed material,which is developed from unsaturated polyester sheet molding compound(SMC).
环氧片状模塑料(ESMC)是在不饱和聚酯树脂片状模塑料(SMC)的基础上研究出来的一种新型模压料,可应用于高强度、高腐蚀、高绝缘部件的生产。
2)  sheet molding compounds
片状模塑料
1.
Study on flame-retardance of sheet molding compounds and its preparing;
新型阻燃片状模塑料的制备及其性能研究
2.
The polyurethone prepolymer was used as thickener to thicken hydrol-terminated unsaturated polyester, and a new sheet molding compounds (SMC) of unsaturated polyester was prepared.
采用聚氨酯预聚物作增稠剂对带端羟基的不饱和聚酯进行增稠,制备出一种新型的不饱和聚酯片状模塑料(SMC),并研究了其增稠性能、增韧性能及贮存稳定性。
3.
The effect of glassfiber cloth,short glass fiber and calcium carbonate on mechanical properties of unsaturated polyester sheet molding compounds was studied.
研究了玻纤布、短切玻纤及碳酸钙对不饱和聚酯片状模塑料力学性能的影响,实验发现:玻纤布增强不饱和聚酯片状模塑料的力学性能比短切玻纤好,随着玻纤含量的增加,不饱和聚酯片状模塑料的拉伸强度先增加,达到一极大值之后减少。
3)  SMC
片状模塑料
1.
Sheet molding compound (SMC) is a thermosetting material made of unsaturated polyester resin, organic additives, the initiator, calcium carbonate, thickener and chopped glass fibres strands that are mixed and form sheets.
片状模塑料(Sheet Molding Compound,简称SMC)是一种加入不饱和聚酯树脂、有机添加剂、引发剂、碳酸钙、增稠剂和短切玻璃纤维等组分混合而成的热固性复合材料。
2.
The effects of dense packing fillers on the processing properties such as paste viscosity,mechanical properties and surface qualities of the sheet molding compound(SMC) products were investigated.
根据填料球-球双峰堆砌理论,通过激光粒度分析仪测定了几种不同比例填料复合后的粒径分布,使用连续级分法计算复合后填料的空隙率,得到了可实现密堆砌填料的类型和复合比例;通过测试树脂糊黏度、片状模塑料(SMC)试样的力学性能以及模压产品的表面波纹,研究了密堆砌填料对SMC生产的工艺性、力学性能以及模压产品表面质量的影响。
4)  sheet molding compound
片状模塑料
1.
The possibility of Taihu Lake silt applied for the sheet molding compound filler was studied from the silt chemical and physical properties and its structure.
为了将太湖淤泥用作片状模塑料复合材料的填料,从淤泥物化性能和结构特征对太湖淤泥进行了表征和分析。
2.
The effect of different type of resins and low-profile additives and flame resistance reagents on the mechanical and flame resistance performance of Sheet Molding Compound(SMC) were studied by orthogonal tests method in this paper.
本文运用正交设计的实验方法,研究了不同树脂体系、低轮廓添加剂体系以及阻燃剂体系对SMC材料力学性能和阻燃性能的影响;通过测试拉伸强度和氧指数,确定了高阻燃片状模塑料的最佳配方组成,并对ATH实现高阻燃效果进行了分析。
5)  Epoxy Molding Compound
环氧模塑料
1.
Progress in Research and Application of Epoxy Molding Compound in Packaging of Integrated Circuit;
环氧模塑料在集成电路封装中的研究及应用进展
2.
Synthesis of Hexaphenylamine Cyclotriphosphazene Flame Retardant and Its Application in Epoxy Molding Compound for Large-scale Integrated Circuit Packaging
六苯胺环三磷腈的制备及其对大规模集成电路封装用环氧模塑料的无卤阻燃
3.
The formulation and the processing of the epoxy molding compound(EMC) for electronic packaging mainly were researched.
主要对集成电路封装用环氧树脂模塑料的配方及工艺进行了研究,采用硅微粉偶联剂处理、高速混合、双辊开炼等,对环氧模塑料工艺流程进行了试验,获得了较佳的工艺条件;以高纯度邻甲酚醛环氧树脂为基体树脂,以硅微粉为填充剂,采用正交试验法对封装用模塑料进行了配方优化,获得了较优配方。
6)  epoxy molding compounds
环氧模塑料
1.
A new type of epoxy molding compounds with high thermal conductivity was obtained using Si3N4 powder as filler.
采用Si3N4陶瓷作填料,制备了一类新型高导热的环氧模塑料,研究了Si3N4的含量、分布及其形态对复合材料的导热性能及介电性能的影响。
2.
A kind of epoxy molding compounds (EMC) filled with silicon dioxide alumina and silicon nitride powder was obtained.
选用SiO_2、Al_2O_3、Si_3N_4三种陶瓷颗粒的复合填充环氧模塑料(EMC),研究了不同填料种类、含量对EMC导热系数、热膨胀系数(CTE)、介电常数等性能的影响随着填料百分含量的增加,EMC的热导率、介电常数也随之增加,而其热膨胀系数显著下降相同体积百分含量下,Al_2O_3、Si_3N_4复合体系EMC热导率和介电常数高于SiO_2、Si_3N_4复合体系,而其热膨胀系数比后者低。
3.
A type of epoxy molding compounds using SiO_2、Al_2O_3、Si_3N_4 as fillers was obtained by orthogonal layout and thermal press method.
采用扫描电子显微镜(SEM)对制备试样的微观结构进行分析,并用热导测试仪、PCY-III型膨胀系数测试仪及介电常数测试仪分别测试了环氧模塑料(EMC)的热导率、热膨胀系数(CTE)和介电常数。
补充资料:片状模塑料
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性质:短切玻璃纤维毡浸渍液体不饱和聚酯树脂浆料,经化学稠化而成的干片状预浸料。分SMC-R(无规玻纤)、SMC-C(连续玻纤)、SMC-O(定向玻纤)三种类型。适于制造薄板形材料,压制薄型产品。机械性能好、尺寸稳定性高、表面光洁、耐热、耐蚀性优良,电性能、尤其耐电弧性好。将树脂、填料,引发剂、阻聚剂、增稠剂、内碚模剂、低收缩添加剂等助剂配成树脂浆料,然后在SMC机中浸渍短切玻璃纤维毡,并用聚乙烯薄膜覆盖上、下表面,辊压密实、烘干、收卷制得预成型片状材料。使用时,揭去薄膜,裁切叠层,放入压模中加温加压即得制品。生产工艺操作简单方便,无断纤飞扬,对温度和压力要求不高,适于自动化机械生产。用做电器零件、汽车壳件,耐蚀、耐冲击部件,窗框、座椅、建筑嵌板,卫生洁具,耐蚀容器、管道等。

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