1) EMC of solid
固态环氧模塑料
2) EMC of liquid
液态环氧模塑料
3) Epoxy Molding Compound
环氧模塑料
1.
Progress in Research and Application of Epoxy Molding Compound in Packaging of Integrated Circuit;
环氧模塑料在集成电路封装中的研究及应用进展
2.
Synthesis of Hexaphenylamine Cyclotriphosphazene Flame Retardant and Its Application in Epoxy Molding Compound for Large-scale Integrated Circuit Packaging
六苯胺环三磷腈的制备及其对大规模集成电路封装用环氧模塑料的无卤阻燃
3.
The formulation and the processing of the epoxy molding compound(EMC) for electronic packaging mainly were researched.
主要对集成电路封装用环氧树脂模塑料的配方及工艺进行了研究,采用硅微粉偶联剂处理、高速混合、双辊开炼等,对环氧模塑料工艺流程进行了试验,获得了较佳的工艺条件;以高纯度邻甲酚醛环氧树脂为基体树脂,以硅微粉为填充剂,采用正交试验法对封装用模塑料进行了配方优化,获得了较优配方。
4) epoxy molding compounds
环氧模塑料
1.
A new type of epoxy molding compounds with high thermal conductivity was obtained using Si3N4 powder as filler.
采用Si3N4陶瓷作填料,制备了一类新型高导热的环氧模塑料,研究了Si3N4的含量、分布及其形态对复合材料的导热性能及介电性能的影响。
2.
A kind of epoxy molding compounds (EMC) filled with silicon dioxide alumina and silicon nitride powder was obtained.
选用SiO_2、Al_2O_3、Si_3N_4三种陶瓷颗粒的复合填充环氧模塑料(EMC),研究了不同填料种类、含量对EMC导热系数、热膨胀系数(CTE)、介电常数等性能的影响随着填料百分含量的增加,EMC的热导率、介电常数也随之增加,而其热膨胀系数显著下降相同体积百分含量下,Al_2O_3、Si_3N_4复合体系EMC热导率和介电常数高于SiO_2、Si_3N_4复合体系,而其热膨胀系数比后者低。
3.
A type of epoxy molding compounds using SiO_2、Al_2O_3、Si_3N_4 as fillers was obtained by orthogonal layout and thermal press method.
采用扫描电子显微镜(SEM)对制备试样的微观结构进行分析,并用热导测试仪、PCY-III型膨胀系数测试仪及介电常数测试仪分别测试了环氧模塑料(EMC)的热导率、热膨胀系数(CTE)和介电常数。
5) EMC
环氧模塑料
1.
Influence of Waxes on the Properties of EMC
脱模剂对环氧模塑料性能影响的研究
2.
The epoxy molding compounds (EMC) was prepared by hot pressing molding method.
采用热模压法制备了环氧模塑料(EMC)。
3.
Epoxy molding compound(EMC)is one of the most important micro-electronic packaging material.
环氧模塑料是一种重要的微电子封装材料,是决定最终封装性能的主要材料之一,具有低成本和高生产效率等优点,目前已经成为半导体封装不可或缺的重要材料。
6) Epoxy sheet molding compound
环氧片状模塑料
1.
Epoxy sheet molding compound(ESMC) is a kind of new compressed material,which is developed from unsaturated polyester sheet molding compound(SMC).
环氧片状模塑料(ESMC)是在不饱和聚酯树脂片状模塑料(SMC)的基础上研究出来的一种新型模压料,可应用于高强度、高腐蚀、高绝缘部件的生产。
补充资料：塑料材料的固态性质表
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条