Review on application of laser soldering technology to join high density packaging device with lead-free solder;

This paper investigates the intermetallic compound on the interface between AuSn solder and Au or Au/Ni metallization layer after laser soldering by SEM and EDX analysis.

In this paper an experimental investigation was made on laser soldering of diamond grain.

A three dimensional model was developed for the laser soldering temperature field in multilayer materials.

The laser soldering mechanism,the kinds of laser soldering source,and the application of laser soldering in surface mount technology(SMT)were introduced in the paper.

Experimental research on laser brazing of diamond grits with a Ni-based filler alloy;

Study of seam appearance and joint quality in laser brazing for galvanized steel sheets;

Three continuous reaction layers form between the silver-based filler metal and SS during laser brazing and are austenite(A),martensite(M),A + M and α-Ag + α′-C.

Diode laser soldering system was used to study and explore the ways to improve the wettability of Sn96Ag3.

Wettability and spreadability of Sn-Ag-Cu lead-free solder on Cu substrate were tested by diode laser soldering system,influence of different soldering parameters on wettability and spreadability of Sn-Ag-Cu lead-free solder was studied.

Effects of heating time on wettability and spreadability of paste solders on Cu substrate with diode laser soldering system;

Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering;

Characteristics of laser welding-brazing joint of Al/Ti dissimilar alloys;

Interface characteristic and property of Ti/Al dissimilar alloys joint with laser welding-brazing;

Welding characteristics of Al/Ti dissimilar alloys by laser welding-brazing with different spot;