1) optical fiber attachment soldering
光纤固定软钎焊
1.
<Abstrcat>A model of Three Dimensional (3-D) shape of solder joint in optical fiber attachment soldering and the energy boundary condition were established.
本文在建立光纤固定软钎焊焊点模型及能量边界条件的基础上,利用有限元方法对焊点三维形态进行数值模拟并分析材料及结构等参数对焊点形态的影响规律。
2) laser soldering
激光软钎焊
1.
Review on application of laser soldering technology to join high density packaging device with lead-free solder;
激光软钎焊技术在高密度封装器件无铅连接中的应用
2.
This paper investigates the intermetallic compound on the interface between AuSn solder and Au or Au/Ni metallization layer after laser soldering by SEM and EDX analysis.
对激光软钎焊下AuSn钎料与Au和Au/Ni金属化镀层界面形成的金属间化合物进行SEM及EDX分析,并讨论激光输入能量对界面金属间化合物演变规律的影响。
3) solder
[英]['səʊldə(r)] [美]['sɑdɚ]
软钎焊料
1.
A method for measuring wetting angle of solder;
一种软钎焊料润湿角的测量方法
4) soldering
[英]['sɔldə] [美]['sɑdɚ]
软钎焊
1.
Soldering Between Ceramic Substrate(Al_2O_3)and Metal Titanium Carrier;
钛板与陶瓷板(Al_2O_3)的软钎焊
2.
Laser soldering technology has been found an important application in micro-electronic joining and packaging.
激光软钎焊技术在微电子焊接和封装方面具有重要的应用价值。
3.
An influence of solder compositions, soldering temperature,flux on solder's flowing property of has been concluded.
对多种锡铅焊料进行一系列不同条件下的漫流性试验 ,分析它们在铜表面上的铺展状况 ,最后归纳出焊料成分、钎焊温度、助焊剂对软钎焊料漫流性影响的规律。
5) soldered joint
软钎焊接
6) soldering
[英]['sɔldə] [美]['sɑdɚ]
软焊料钎焊
补充资料：软钎焊
分子式：
分子量：
CAS号：
性质：见钎焊。
分子量：
CAS号：
性质：见钎焊。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条