1.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析
2.
Thermal reliability optimization study on PBGA lead-free solder joint
PBGA无铅焊点热可靠性优化研究
3.
Failure analysis of lead-free solder joints based on resistance strain critical point
基于电阻应变临界点的无铅焊点失效分析
4.
Fatigue-Life Predicyion for Lead-Free Solder Joints and Study for Effect of IMC on Reliability of Solder Joints;
无铅焊点寿命预测及IMC对可靠性影响的研究
5.
Board Level Lead-Free Solder Joints Reliability Analysis under Drop Shock Loading;
板级无铅焊点跌落冲击载荷下可靠性分析
6.
Peel Stress Analysis of Lead-free Solder Ball Based on Numerical Simulation;
基于数值模拟的无铅焊点剥离应力分析
7.
Finite Element Simulation and Life Prediction for Reliability of Lead-free Solder in PBGA;
PBGA无铅焊点可靠性的有限元模拟与寿命预测
8.
Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;
电子封装中无铅焊点的界面演化和可靠性研究
9.
Research on the Theory & Experiments of SMT Lead-Free Solder Joint Reliability under Drop Impact;
跌落碰撞下SMT无铅焊点可靠性理论与实验研究
10.
Mechanism and Reliability of Lead Free Joints Fabricated by Low Temperature Ultrasonic Bonding
无铅焊点低温超声互连的机理及可靠性研究
11.
Study of Intermatallic Compounds and Kirkendall Voids in Solder Joints of Lead-free Solder
无铅焊点界面化合物及Kirkendall空洞实验研究
12.
The Morphology and Aging Evolution of IMC in low-Ag SnAgCu Soldering
低银无铅焊点的界面化合物形貌与演变
13.
Resistance strain and temperature hysteresis loops properties of lead free solder joint
无铅焊点的电阻应变温度迟滞回线特性
14.
Robust Positioning Algorithm of Lead-Free Solder Joints Based on Gray-Level Integration Projection
无铅焊点鲁棒定位的灰度积分投影算法
15.
Failure Analysis of BGA Lead-free Solder Joints under Drop Impact
跌落碰撞下球栅阵列无铅焊点失效分析
16.
Effect of Thermomechanical Fatigue on Properties of Lead-Free Solder Joint with Nano-Structured Reinforcements
热疲劳对纳米结构强化的无铅焊点性能的影响
17.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
18.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究