1) Si-Al electronic packaging materials
Si-Al电子封装材料
2) electronic packaging material
电子封装材料
1.
The CPC electronic packaging materials have the best integrated properties when annealed under the temperat.
研究了不同退火工艺对轧制复合CPC电子封装材料力学性能、物理性能的影响。
2.
Two kinds of high silicon aluminum alloys, applied in lightweight electronic packaging material in the aviation and space fields, were prepared with the rapidly solidified high-silicon aluminum alloy(Al-30%Si) powder by vacuum canning and hot-extrusion processes.
通过对快速凝固高硅铝合金粉末(Al30%Si)进行真空包套热挤压,制备出高硅铝合金电子封装材料,研究了粉末粒度对高硅铝合金材料组织及性能的影响。
3.
The results show that Kovar/Cu/Kovar electronic packaging material has good interfacial combination strength with acceptable resistivity and high tensile strength at 800℃ and 50% single-pass deformation rate.
结果表明,轧制温度为800℃,单道次变形率为50%时,Kovar/Cu/Kovar电子封装材料的界面结合强度较好,电阻率、抗拉强度等性能均达到要求。
3) electronic encapsulation materials
电子封装材料
1.
A novel lower viscosity and higher heat-reliability electronic encapsulation materials based on benzoxazine;
1种低黏度高热可靠性苯并口恶嗪电子封装材料
4) electronic packaging materials
电子封装材料
1.
Microstructure and properties of W-Cu electronic packaging materials by plasma spraying;
等离子喷涂W-Cu电子封装材料的组织与性能
2.
Chemical synthesis of high electrical conductivity polypyrrole film on the surface of electronic packaging materials;
电子封装材料表面化学制备高导电率聚吡咯薄膜的研究
3.
The spray-deposited Si-Al(50~70 Si,wt%) alloys are one of the novel electronic packaging materials due to their lower thermal expansion coefficients,high heat conductivity and lower density.
喷射成形Si-Al(wSi=50%～70%)合金因其低的热膨胀系数、高的热导率和低的密度而成为一类新型的电子封装材料。
5) aluminum silicon carbide electronic packaging materials
AlSiC电子封装材料
6) Si based optoelectronic materials
Si基光电子材料
1.
The important developments in electronic structure theory of semiconductor quantum structure and its application for designing Si based optoelectronic materials are reviewed.
评述近年来在半导体量子结构电子态理论应用于 Si基光电子材料设计方面的重要进展 。
补充资料：Al-Si cast aluminium alloy
分子式：
CAS号：
性质：以硅为主要合金元素的铸造铝合金。硅的添加量范围为5％～25％，并添加镁、铜等元素，形成亚共晶型、共晶型或过共晶型合金。含硅量为5％～13％的亚共晶型或共晶型合金是工业生产中应用最广泛的铸造铝合金。良好的铸造工艺性能和气密性是它们的主要特点。含硅量在13％以上的过共晶型合金具有热膨胀系数小、耐磨性好等特点。
CAS号：
性质：以硅为主要合金元素的铸造铝合金。硅的添加量范围为5％～25％，并添加镁、铜等元素，形成亚共晶型、共晶型或过共晶型合金。含硅量为5％～13％的亚共晶型或共晶型合金是工业生产中应用最广泛的铸造铝合金。良好的铸造工艺性能和气密性是它们的主要特点。含硅量在13％以上的过共晶型合金具有热膨胀系数小、耐磨性好等特点。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条