1.
Research Progress of Diamond-Cu Composite Material for Electronic Packaging
电子封装材料用金刚石/铜复合材料的研究进展
2.
Thermophysical Properties of Aluminum Infiltrated Silicon Carbide for Electronic Packaging;
铝渗碳化硅电子封装材料的热物理性能
3.
Study on Electronic Encapsulation Material Basied on Benzoxazine Resin;
苯并噁嗪树脂在电子封装材料中的应用研究
4.
The Structure and Properties of Al/SiCp Composites Preparated by Pressureless Infiltration for Electronic Packaging;
无压浸渗制备Al/SiCp电子封装材料的结构与性能
5.
Investigation on Al/SiCp Electronic Packaging Materials Fabricated by Gas Pressure Infiltrating Processes;
气压浸渗法制备Al/SiCp电子封装材料的研究
6.
The Preparation and Property Research of Epoxy Resin Based Electric Electronic Packaging Material;
环氧树脂电力、电子封装材料的制备及其性能研究
7.
Fabrication and Microstructures and Thermal Physical Property of SiCp/Al Electronic Packing Materials Made Through Subsonic Flame Spraying Technique;
喷涂SiCp/Al电子封装材料制备、组织与热物性的研究
8.
Pressureless Infiltration of SiCp/Al Electronic Packaging Materials with Particles of Bimodal Size Distribution;
无压浸渗制备双尺寸颗粒SiCp/Al电子封装材料的研究
9.
Theoretical Arithmetic and Optimum Design for the 0-3 Electronic Packaging Composites;
0-3型复合电子封装材料的理论计算与优化设计
10.
Fabrication and Properties of β-SiCp/Al Electronic Packaging Material by Pressureless Infiltration;
无压浸渗法制备β-SiCp/Al电子封装材料工艺与性能研究
11.
Study on the Preparation and Properties of Electronic Packaging Material ZrW_2O_8/E-51 with Lower Linear Expansion Coefficient;
低膨胀系数电子封装材料ZrW_2O_8/E-51的制备与性能研究
12.
Study on Synthesis and Performances and of Epoxy Resin Materaials Used in Elexctronic Packaging
电子封装材料用新型环氧树脂的制备及性能研究
13.
Electron-induced Damage of CMOS with Shielded Packages
屏蔽材料封装CMOS器件的电子辐照损伤
14.
The Research on Properties of SiC_p/Al Composite for Electronic Packaging;
电子封装SiC_p/Al 复合材料性能及影响因素研究
15.
Fabrication and Properties of SiC_p/Al Electrical Packaging Composites by Spark Plasma Sintering;
SiC_p/Al电子封装复合材料的SPS烧结及性能研究
16.
Composites Based on Cyanate Ester Resin for Microelectrical Packaging
电子封装用氰酸酯树脂基复合材料的研究
17.
Research progress of diamond/metal composites for electronic packaging
电子封装用金刚石/金属复合材料研究进展
18.
Progress in Research and Application of Si_p/Al Composites for Electronic Packaging
电子封装用Si_p/Al复合材料的研究应用进展