1) bimetal contact rivet
复合铆钉触点
2) compound
复合
1.
Technique of compound chemical blockage removal with water-gas pulsating wave;
水气脉冲波复合化学解堵技术
2.
Applied research of compound deplugging by vibration acidization;
振动酸化复合解堵增注技术应用研究
3.
Preparation and properties of bamboo charcoal-chitosan compound sorbent;
竹炭—壳聚糖复合吸附剂的制备及其性能
3) compounding
复合
1.
Studies were undertaken on the key points in the compounding and processing technology of the juice with carrot and tomato as the major materials,and orthogonal tests were done to get the optimum formulas for carrot and tomato juices.
以胡萝卜、番茄为原料,对其复合制作工艺中的技术要点进行了研究,应用正交试验筛选出了胡萝卜汁和番茄汁的最佳配方,经过反复实验确定了最适合的工艺流程,并对加工过程中维生素C、胡萝卜素的稳定性、影响因素及保护措施进行了探讨。
2.
The modification of aqueous polyurethane dispersion is focused on crosslinking and compounding technologies.
交联改性和复合改性是近年来水性聚氨酯改性方法研究的重点,论述了各种改性技术的基本理论和实施方法。
3.
This paper introduces the investigation and progress on titanium dioxide responding to visiblelight irradiation as a result of doping and compounding.
从纳米TiO2的掺杂和复合两方面,介绍了近年来实现其可见光化的研究进展。
4) Composite
复合
1.
The Study of Class Ceramics—Ceramics Composite Bora's Technics;
微晶玻璃—陶瓷复合曲面板生产工艺研究
2.
Progress on Synthesizing SiO_2/Polymer Nanocomposite Emulsion;
SiO_2/聚合物纳米复合乳液的合成研究进展
3.
Primary Exploration for PTFE membrane and PET Spunbonded Nonwovens Calendering Composite Process;
热轧复合工艺对PTFE膜和PET纺粘非织造布复合材料性能的影响
5) complex
复合
1.
Study on complex cationic silicone softer and its application;
复合阳离子型有机硅柔软剂的研制及应用
2.
Nanometer TiO_2 Photocatalyst Complexed by Semiconductor;
半导体复合TiO_2纳米光催化剂
3.
The application of complex and modified in fiber production;
复合改性及其在化纤生产中的应用
6) composition
复合
1.
Research and Development of Cast Composition PVC Foaming Lining Blanket;
挤塑复合PVC发泡背衬地毯的研制开发
2.
Representing applications and compositions of design patterns in UML;
UML中设计模式应用及复合的表示
参考词条
补充资料:贵金属及其合金复合触点
分子式:
CAS号:
性质: 贵金属及其合金为复层,以铜为基体的双金属复合触点。节约贵金属、降低成本,而又不影响使用性能。有Ag/Cu、AgAul0/Cu、AgCdO12/Cu、AgCe0.5 /Cu、AgNi0.15/Cu、AgNil0/Cu和AgPb20/Cu等。复合触点的复层维氏硬度分别为490~800MPa,500~800MPa,600~760MPa,600~1100MPa,600~800MPa,650~850MPa和700~1200MPa。由贵金属(或其合金)丝与铜丝经复合铆钉机加工成铆钉。AgCdO12和AgNil0丝材是用粉冶-压力加工法制造;AgCdO12还可用内氧化-粉冶法制造。其他合金丝则用一般压力加工法制取。主要用在低压电器、家用电器、仪器仪表中做中小负荷的开关、继电器的电触点。
CAS号:
性质: 贵金属及其合金为复层,以铜为基体的双金属复合触点。节约贵金属、降低成本,而又不影响使用性能。有Ag/Cu、AgAul0/Cu、AgCdO12/Cu、AgCe0.5 /Cu、AgNi0.15/Cu、AgNil0/Cu和AgPb20/Cu等。复合触点的复层维氏硬度分别为490~800MPa,500~800MPa,600~760MPa,600~1100MPa,600~800MPa,650~850MPa和700~1200MPa。由贵金属(或其合金)丝与铜丝经复合铆钉机加工成铆钉。AgCdO12和AgNil0丝材是用粉冶-压力加工法制造;AgCdO12还可用内氧化-粉冶法制造。其他合金丝则用一般压力加工法制取。主要用在低压电器、家用电器、仪器仪表中做中小负荷的开关、继电器的电触点。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。