1) electroless metal plating
化学镀金属
2) metal inducing electroless plating
金属诱导化学镀
1.
The unsupported and supported NiCoB bimetal amorphous alloy catalysts were prepared by metal inducing electroless plating(MIEP) method.
采用金属诱导化学镀(MIEP)法分别制备了非负载型和负载型NiCoB双金属非晶态合金催化剂,并用XRDI、CP和TEM等方法表征了催化剂的结构、组成和形貌等。
3) metal inducing chemical plating
金属诱导化学镀法
4) electroless gold plating
化学镀金
1.
The progress in research on non-cyanide electroless gold plating is reviewed.
综述了化学镀金的研究进展。
2.
The paper is to be published in two parts, introducing the electroless gold plating process in electronic plating industry in Japan.
本文分2部分,介绍了日本电子电镀工业化学镀金工艺。
3.
The second part of the article discusses the method improving the stability of bath systems of potassium borohydride and DMAB, and introduces new electroless gold plating systems, including bath systems of NaAuCl4 with amine borane as reducer, sulfite and thiosulfate.
文章第二部分论述了提高硼氢化钾和DMAB体系镀液稳定性的方法,并介绍了新型化学镀金体系:NaAuCl4的胺硼烷镀液体系、亚硫酸盐镀液体系和硫代硫酸盐镀液体系。
5) electroless gold
化学镀金
1.
The paper introduced a displacement electroless gold plating solution IG-600 for electroless nickel/immersion gold(ENIG) process in printed circuit boards.
文章介绍一种用于电路板化学镀镍/沉金工艺的置换型化学镀金液IG-600。
6) Chemical alloy planting
化学镀合金
补充资料：工程化学障碍物(见化学障碍物)
工程化学障碍物(见化学障碍物)
engineering-chemical obstacle
习U·上日、11匕I一9 nuQXue Zhang’aiwu工程化学障碍物(engineelsng一ehemiealobstacle)见化学障碍物。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条