1) microcrystalline brazing alloy
微晶钎料
1.
High frequency brazing of 0Cr18Ni9Nb to YG6 using Cu-based microcrystalline brazing alloys;
Cu基微晶钎料高频钎焊0Cr18Ni9Nb/YG6分析
2.
The vacuum brazing of 25Cr3MoA steel and YG6 cemented carbide was conducted by using a Cu-11%Sn-2%Ni microcrystalline brazing alloy.
应用Cu 11%Sn-2%Ni微晶钎料对25Cr3MoA钢和YG6硬质合金进行了真空钎焊,观察了接头组织形貌,建立了钎料层/母材原子互扩散模型,定量分析了焊接区合金元素的分布特征,并在专用仪器上测试了接头的剪切强度。
3.
In this paper, high-frequency induction brazing of YG6 to 0Crl8Ni9Nb and vacuum brazing of YG6 to 25Cr3MoA were conducted by using Cu-based microcrystalline brazing alloy foils.
本文应用铜基微晶钎料箔分别对YG6/0Cr18Ni9Nb、YG6/25Cr3MoA进行了高频钎焊和真空钎焊试验研究。
2) amorphous filler metal
非晶钎料
1.
Si3N4 ceramic is brazed with Ti40Zr25Ni15Cu20 amorphous filler metal,the effect of brazing processing parameter on reaction layer products is discussed.
采用Ti40Zr25Ni15Cu20非晶钎料钎焊Si3N4陶瓷,研究了钎焊工艺参数对连接界面产物的影响。
2.
Si_3N_4 ceramic was brazed with Ti40Zr25Ni15Cu20 amorphous filler metal, the effect of brazing processing parameters on interfacial microstructure and joint strength was discussed.
采用Ti40Zr25Ni15Cu20非晶钎料钎焊Si3N4陶瓷,研究钎焊工艺参数对界面反应层和接头连接强度的影响。
3) eutectic solder
共晶钎料
1.
Shear strength of BGA packaging device joints with Sn-Pb eutectic solder were studied in the paper using Micro-joints Strength Tester,and compared BGA joints shear strength with different diameters.
采用微焊点强度测试仪研究了Sn-Pb共晶钎料BGA(球栅阵列封装技术)封装器件焊点的抗剪强度,并对不同直径的BGA球焊点的抗剪强度进行了比较。
2.
The tensile strength of soldered joints of QFP with pure lead is higher than that of eutectic solder and as well and as higher .
研究结果表明,在相同的钎料成分下,焊脚间距越大,所需的抗拉力越大,抗拉强度越高;共晶钎料QFP焊点的抗拉强度比纯铅的抗拉强度低,QFP焊点的结合强度比钎料自身的抗拉强度高。
4) amorphous solder alloys
非晶态钎料
5) SnPb eutectic solder
SnPb共晶钎料
1.
Reaction kinetics between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow;
激光加热条件下SnPb共晶钎料与Au/Ni/Cu焊盘界面反应动力学
2.
SnPb eutectic solder reflow on BGA pad metallized with Au/Ni to form solder bump with induction self excite heat under alternate electromagnetic radiation is performed, and impacts of induction self excite heat and solid state aging on interfacial reaction between SnPb eutectic solder and Au/Ni metallization are investigated.
进行了交变电磁辐射下附Au/Ni镀层BGA焊盘上SnPb共晶钎料球感应自发热重熔形成钎料凸台的实验,并分析了感应自发热重熔以及固态老化对SnPb共晶钎料与Au/Ni镀层焊盘界面反应的影响。
6) eutectic SnBi solder
共晶SnBi钎料
补充资料：钎料
分子式：
CAS号：
性质：为实现两种材料（或零件）的结合，在其间隙内或间隙旁所加的填充物。钎料的熔点必须比焊接的材料熔点低。适宜于连接精密、复杂、多铤缝和异类材料的焊接。钎料按熔点高低分为软钎料（熔点低于450℃的钎料），硬钎料（熔点高于450℃的钎料）。钎料按组成分软钎料有锡基、铅基、锌基等钎料。硬钎料有铝基、银基、铜基、镍基等钎料。
CAS号：
性质：为实现两种材料（或零件）的结合，在其间隙内或间隙旁所加的填充物。钎料的熔点必须比焊接的材料熔点低。适宜于连接精密、复杂、多铤缝和异类材料的焊接。钎料按熔点高低分为软钎料（熔点低于450℃的钎料），硬钎料（熔点高于450℃的钎料）。钎料按组成分软钎料有锡基、铅基、锌基等钎料。硬钎料有铝基、银基、铜基、镍基等钎料。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条