Epoxy potting materials for automobile ignition coils;

Study on modified epoxy resin-encapsulating materials

Milled glass fiber (MG)/polyurethane (PU)/epoxy resin (EP) encapsulating material was prepared by vacuum priming.

Epoxy resin/nano-silica encapsulating materials were obtained from in situ polymerization, and microstructure and properties of the materials were investigated by transmission electron microscopy(TEM),scanning electron microscopy(SEM) and differential scanning calorimetry(DSC).

Properties of Epoxy Encapsulating Materials;

Study on synthesis and mechanics performance of encapsulating materials based on nano-SiO_2/epoxy resin

This paper mainly described the research on rheological property,high thermal stability,flame retardant,the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials,which greatly apply on electronic equipment and large scale integrated circuit and so forth.

The properties and typical applications of polyurethane isolate potting materials were reviewed.

This paper introduces the performances demands and the development of potting materials using in electronic equipment, and the sorts of potting materials.

Study on curing reaction kinetics and properties of epoxy potting compound