1) Potting
[英]['pɔtiŋ] [美]['pɑtɪŋ]
灌封
1.
Development and Application of a Tough Epoxy Potting Heat-insulating Material;
结构柔韧的环氧树脂灌封隔热材料的研制及其应用
2.
Technics Research of Silicone Gel Potting in Communication Equipments
硅树脂凝胶在铁路信号产品灌封中的工艺研究
3.
A novel LG-35 polyurethane potting insulating material was prepared using hydroxyl-terminated polybutadiene and liquld isocyanate, with NN- 101 as chain extender and silica powder as filler at the temperature of 80～100℃ and pressure of - 0.
０９５ＭＰａ条件下，制备了新型ＬＧ－３５聚氨酯灌封材料。
2) sealing
[英]['si:liŋ] [美]['silɪŋ]
灌封
1.
Development on resisting crack for epoxy resin sealing compounds;
耐开裂环氧灌封料的研究进展
2.
A new production method of green electrical packaging material,which can resist fire and crack epoxy resin sealing compounds was introduced.
介绍了电子封装材料绿色阻燃耐开裂环氧树脂灌封料的生产新方法。
3.
The problem of crack initiation in epoxy resin sealing compounds at low temperature is discussed in this paper.
针对如何解决环氧树脂灌封料在低温下易产生开裂这一问题进行了探讨。
3) filling
[英]['fɪlɪŋ] [美]['fɪlɪŋ]
灌封
1.
Development of automatic machine for ampoules rinsing and drying and drug succus filling in field condition;
野战全自动药瓶冲洗吹干药液灌封机的研制
4) encapsulation
[英][in,kæpsju'leiʃən] [美][ɪn,kæpsə'leʃən]
灌封
1.
The solid encapsulation of the electronic vacuum device is an inevitable trend for the military electronic product development; However, there are still some urgent problems such as the delamination defect of the organic silicon gel encapsulation and withstanding pressure, the low temperature resistance defects after the epoxy resin encapsulation.
电真空组件的固体灌封是军用电子产品发展的必然趋势,但目前尚存在一些急待解决的问题,如有机硅凝胶灌注后的脱层缺陷和环氧树脂灌封后的耐压、耐低温缺陷等。
5) casting
[英]['kɑ:stɪŋ] [美]['kæstɪŋ]
灌封
1.
casting processing ability and casting systems,such as epoxy resins,curing agents,fillers,are discussed.
在 4 2篇文献的基础上 ,综述了环氧树脂体系以及添加助剂如填料、增韧剂、固化剂等 ,介绍了各种灌注工艺 ,其中经机械共混得到电气性能、耐候性能优良的灌封体系 ,同时指出了其发展方向。
6) encapsulating
[英][in'kæpsju,leit] [美][ɪn'kæpsə,let]
灌封
1.
With the development of electronic device miniaturization, the lightweight and the high performance, high-performance encapsulating materials were required.
随着电子器件的小型化、轻量化及高性能化,电子领域对灌封材料的性能提出了更高的要求。
2.
Two kinds of vinyl end silicone oil of different viscosities and one branched vinyl silicone oil blends are chosen as encapsulating silicone rubber.
s(411-4800)的支链型端乙烯基硅油复配体系作为灌封硅橡胶的基础胶,筛选出较好的基础胶配比,并以沉淀法和气相法白炭黑进行补强,研究了不同用量和品种的白炭黑补强对灌封材料粘度、力学性能、粘接性能和电学性能的影响。
补充资料：电力电容器灌封料
分子式：
CAS号：
性质：树脂(A)为聚醚填充料等，固化剂(B)为改性异氰酸酯等。由聚醚与辅助材料经脱水精制后再加填充料和催化剂进行反应，然后经研磨混合、过滤而成。树脂为白色或黄色黏液。密度1.35～1.40g/cm3。黏度(25℃)7000mPa·s左右。固化剂为黑色或黄色黏液。密度1.10～1.15g/cm3，黏度(25℃)5500mPa·s左右。用于电容器元件特别适用于电力电容器的表面密封和固定。
CAS号：
性质：树脂(A)为聚醚填充料等，固化剂(B)为改性异氰酸酯等。由聚醚与辅助材料经脱水精制后再加填充料和催化剂进行反应，然后经研磨混合、过滤而成。树脂为白色或黄色黏液。密度1.35～1.40g/cm3。黏度(25℃)7000mPa·s左右。固化剂为黑色或黄色黏液。密度1.10～1.15g/cm3，黏度(25℃)5500mPa·s左右。用于电容器元件特别适用于电力电容器的表面密封和固定。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条